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Characterization of the silicon nitride-thermal oxide interface in ONO structures by ELS, XPS, ellipsometry, and numerical simulation

  • V. A. Gritsenko
  • , Yu N. Morokov
  • , Yu N. Novikov
  • , I. P. Petrenko
  • , S. N. Svitasheva
  • , H. Wong
  • , R. Kwok
  • , R. Chan

Research output: Chapters, Conference Papers, Creative and Literary WorksRGC 32 - Refereed conference paper (with host publication)peer-review

Abstract

Using electron energy loss spectroscopy (ELS), XPS, and ellipsometry measurements, large amount of Si-Si bonds at Si3N4/thermal SiO2 interface are identified. Abnormally large value of refractive index (n = 2.1) in the Si3N4/SiO2 interface layer was obtained. The effective width of Si-rich interfacial layer is estimated to be about 5-10 angstroms. The excess silicon at Si3N4/SiO2 interface was created by replacing nitrogen with oxygen during the oxidation of Si3N4. The abnormally large electron capturing at Si3N4/SiO2 interface observed previously and the accumulation of positive charge at top interface of nitrided oxide under ionizing irradiation are explained with the existence of Si-Si bonds at Si3N4/SiO2 interface.
Original languageEnglish
Title of host publicationProceedings of the International Conference on Microelectronics
PublisherIEEE
Pages111-114
Volume1
Publication statusPublished - 1997
Externally publishedYes
EventProceedings of the 1997 21st International Conference on Microelectronics, MIEL'97. Part 1 (of 2) - Nis, Yugosl
Duration: 14 Sept 199717 Sept 1997

Publication series

Name
Volume1

Conference

ConferenceProceedings of the 1997 21st International Conference on Microelectronics, MIEL'97. Part 1 (of 2)
CityNis, Yugosl
Period14/09/9717/09/97

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