Characteristics of Si Thin Films Transferred onto Glass by Ion-Cut Employing Pulsed and Direct-Current (DC) Plasma Immersion Ion Implantation

F. Lu; D. Qiao; M. Cai; P. K.L. Yu; S. S. Lau; R. K. Y. Fu; C. P. Li; L. S. Hung; Paul K. Chu

Characteristics of Si Thin Films Transferred onto Glass by Ion-Cut Employing Pulsed and Direct-Current (DC) Plasma Immersion Ion Implantation

F. Lu
, D. Qiao
, M. Cai
, P. K.L. Yu
, S. S. Lau
, R. K. Y. Fu
, C. P. Li
, L. S. Hung
, Paul K. Chu

Research output: Conference Papers › RGC 33 - Other conference paper › peer-review

Original language	English
Pages	22
Publication status	Presented - Jun 2003
Event	45th TMS Electronic Materials Conference & Exhibition (EMC 2003) - Salt Lake City, United States Duration: 25 Jun 2003 → 27 Jun 2003

Conference

Conference	45th TMS Electronic Materials Conference & Exhibition (EMC 2003)
Place	United States
City	Salt Lake City
Period	25/06/03 → 27/06/03

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@conference{b8a464017aab4c96a1044f6635d7fe6b,

title = "Characteristics of Si Thin Films Transferred onto Glass by Ion-Cut Employing Pulsed and Direct-Current (DC) Plasma Immersion Ion Implantation",

author = "F. Lu and D. Qiao and M. Cai and Yu, \{P. K.L.\} and Lau, \{S. S.\} and Fu, \{R. K. Y.\} and Li, \{C. P.\} and Hung, \{L. S.\} and Chu, \{Paul K.\}",

year = "2003",

month = jun,

language = "English",

pages = "22",

note = "45th TMS Electronic Materials Conference \& Exhibition (EMC 2003) ; Conference date: 25-06-2003 Through 27-06-2003",

}

Characteristics of Si Thin Films Transferred onto Glass by Ion-Cut Employing Pulsed and Direct-Current (DC) Plasma Immersion Ion Implantation. / Lu, F.; Qiao, D.; Cai, M. et al.
2003. 22 45th TMS Electronic Materials Conference & Exhibition (EMC 2003), Salt Lake City, Utah, United States.

Research output: Conference Papers › RGC 33 - Other conference paper › peer-review

TY - CONF

T1 - Characteristics of Si Thin Films Transferred onto Glass by Ion-Cut Employing Pulsed and Direct-Current (DC) Plasma Immersion Ion Implantation

AU - Lu, F.

AU - Qiao, D.

AU - Cai, M.

AU - Yu, P. K.L.

AU - Lau, S. S.

AU - Fu, R. K. Y.

AU - Li, C. P.

AU - Hung, L. S.

AU - Chu, Paul K.

PY - 2003/6

Y1 - 2003/6

M3 - RGC 33 - Other conference paper

SP - 22

T2 - 45th TMS Electronic Materials Conference & Exhibition (EMC 2003)

Y2 - 25 June 2003 through 27 June 2003

ER -