Centrifugation of microparticles inside a sessile droplet on a micromachined silicon chip using acoustic tweezers
Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review
Author(s)
Related Research Unit(s)
Detail(s)
| Original language | English |
|---|---|
| Title of host publication | 33rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2020) |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. |
| Pages | 1130-1133 |
| ISBN (electronic) | 9781728135809, 9781728135816 |
| ISBN (print) | 9781728135823 |
| Publication status | Published - Jan 2020 |
Publication series
| Name | Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS) |
|---|---|
| Volume | 2020-January |
| ISSN (Print) | 1084-6999 |
| ISSN (electronic) | 2160-1968 |
Conference
| Title | 33rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2020) |
|---|---|
| Place | Canada |
| City | Vancouver |
| Period | 18 - 22 January 2020 |
Link(s)
Abstract
This paper reports the first demonstration of acoustic tweezers to manipulate microparticles in a sessile droplet over a functional surface-micromachined silicon chip fabricated with polysilicon micromechanical sensing structures. The proposed plug-and-play setup comprises two interchangeable parts: a detachable silicon micromachined sensor chip (acting as a superstrate) and a surface acoustic wave (SAW) device substrate. The SAW device provides the off-chip acoustic source from which Rayleigh waves couple into the functional silicon chip. We demonstrate concentration of initially randomly dispersed microparticles in a water droplet loaded on the functional silicon chip by means of acoustic streaming forces using a drive power of 1 W.
Research Area(s)
- acoustic streaming, centrifugation-on-chip, MEMS, surface acoustic wave devices
Citation Format(s)
Centrifugation of microparticles inside a sessile droplet on a micromachined silicon chip using acoustic tweezers. / Qian, Jingui; Begum, Habiba; Lee, Joshua E.-Y.
33rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2020). Institute of Electrical and Electronics Engineers, Inc., 2020. p. 1130-1133 9056206 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); Vol. 2020-January).
33rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2020). Institute of Electrical and Electronics Engineers, Inc., 2020. p. 1130-1133 9056206 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); Vol. 2020-January).
Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review
