Catalysis of dispersed silver particles on directional etching of silicon

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

15 Scopus Citations
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Author(s)

  • Y. M. Yang
  • Z. W. Wu
  • S. H. Pu
  • T. F. Hung
  • K. F. Huo
  • G. X. Qian
  • W. J. Zhang
  • X. L. Wu

Detail(s)

Original languageEnglish
Pages (from-to)3061-3066
Journal / PublicationApplied Surface Science
Volume254
Issue number10
Publication statusPublished - 15 Mar 2008

Abstract

Silver particles are dispersed on silicon by magnetron sputtering and post-annealing to investigate the catalytic effects of individual silver particles on wet etching of silicon surface. According to scanning electron microscopy, dispersed deep holes are present and the major etching direction is vertical to the surface of a Si(1 0 0) wafer or inclined to that on a Si(1 1 1) wafer. Our experiments indicate that the effect of the anisotropy of Si on directional etching is fundamental and the wafer resistivity and experimental process have important influence on the etching results. In addition, aggregation of silver particles and random horizontal etching on the surface of the wafer are caused by the local imbalance between the oxidant and HF. Our results enable better understanding of the catalytic effects of metal particles on silicon and are helpful to the preparation new silicon nanostructures. © 2007 Elsevier B.V. All rights reserved.

Research Area(s)

  • Directional etching, Metal catalysis, Porous silicon

Citation Format(s)

Catalysis of dispersed silver particles on directional etching of silicon. / Yang, Y. M.; Chu, Paul K.; Wu, Z. W.; Pu, S. H.; Hung, T. F.; Huo, K. F.; Qian, G. X.; Zhang, W. J.; Wu, X. L.

In: Applied Surface Science, Vol. 254, No. 10, 15.03.2008, p. 3061-3066.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal