TY - GEN
T1 - Boosting the Quality Factor of Low Impedance VHF Piezoelectric-on-Silicon Lateral Mode Resonators Using Etch Holes
AU - Tu, C.
AU - Lee, J. E.-Y
PY - 2016/10
Y1 - 2016/10
N2 - We report a unique method of using etch-holes to greatly improve the unloaded quality factor (Qu) of VHF-band low impedance laterally vibrating AlN Thin-film Piezoelectric-on-Silicon (TPoS) MEMS resonators. We have validated the proposed method experimentally by applying it to fabricated devices with resonant frequencies of 105 MHz. Based on the experimental results of several fabricated samples, we show that the quality factors of the resonators consistently improve by almost four times using the proposed method. The experimental results are corroborated by finite-element (FE) simulations, which show that the holes re-distribute the strain energy in the resonator and suppress the movement in the supporting beam tethers. Less energy in the tethers leads to reduction of anchor loss and thus enhances Qu.
AB - We report a unique method of using etch-holes to greatly improve the unloaded quality factor (Qu) of VHF-band low impedance laterally vibrating AlN Thin-film Piezoelectric-on-Silicon (TPoS) MEMS resonators. We have validated the proposed method experimentally by applying it to fabricated devices with resonant frequencies of 105 MHz. Based on the experimental results of several fabricated samples, we show that the quality factors of the resonators consistently improve by almost four times using the proposed method. The experimental results are corroborated by finite-element (FE) simulations, which show that the holes re-distribute the strain energy in the resonator and suppress the movement in the supporting beam tethers. Less energy in the tethers leads to reduction of anchor loss and thus enhances Qu.
KW - anchor loss
KW - etch holes
KW - Piezoelectric-on-silicon resonators
UR - http://www.scopus.com/inward/record.url?scp=85010000298&partnerID=8YFLogxK
UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-85010000298&origin=recordpage
U2 - 10.1016/j.proeng.2016.11.443
DO - 10.1016/j.proeng.2016.11.443
M3 - RGC 32 - Refereed conference paper (with host publication)
SN - 1877-7058
VL - 168
SP - 1261
EP - 1264
BT - Procedia Engineering
PB - Elsevier
T2 - 30th Eurosensors Conference, Eurosensors 2016
Y2 - 4 September 2016 through 7 September 2016
ER -