Bonding structure of silicon oxynitride grown by plasma-enhanced chemical vapor deposition

C. K. Wong, Hei Wong, V. Filip, P. S. Chung

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

12 Citations (Scopus)

Abstract

Silicon oxynitride films were prepared by plasma enhanced chemical vapor deposition (PECVD) with N2O, NH3, and SiH4 precursors. X-ray photoelectron spectroscopy (XPS) and refractive index characterization showed that different film compositions, from silicon dioxide to stoichiometric silicon nitride, are achievable by tuning the flow rate of nitrous oxide in a mixture of precursor gases. The refractive index of silicon oxynitride (SiON) films is linearly proportional to the nitrogen content of these films, making these films a desirable candidate for optical waveguide applications. In addition, a detailed compositional analysis of the oxynitride films was conducted by XPS. By the Gaussian deconvolution of Si 2p XPS spectra, we confirmed that the structure of PECVD silicon oxynitride films should be in the form of the random bonding and the films should have homogenous optical and electrical characteristics. © 2007 The Japan Society of Applied Physics.
Original languageEnglish
Pages (from-to)3202-3205
JournalJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Volume46
Issue number5 B
DOIs
Publication statusPublished - 17 May 2007

Research Keywords

  • Bonding structure
  • PECVD
  • Random bonding
  • Silicon oxynitride
  • X-ray photoelectron spectroscopy

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