Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration

S. W. Liang; Chih Chen; J. K. Han; Luhua Xu; K. N. Tu; Yi-Shao Lai

doi:10.1063/1.3410796

Author(s)

S. W. Liang
Chih Chen
J. K. Han
Luhua Xu
Yi-Shao Lai

Detail(s)

Original language	English
Article number	093715
Journal / Publication	Journal of Applied Physics
Volume	107
Issue number	9
Publication status	Published - 1 May 2010
Externally published	Yes

Link(s)

DOI	DOI https://doi.org/10.1063/1.3410796 Final Published version
	Check@CityULib
Link to Scopus	https://www.scopus.com/record/display.uri?eid=2-s2.0-79251494119&origin=recordpage
Permanent Link	https://scholars.cityu.edu.hk/en/publications/publication(72a2b1a1-8a61-4798-afa0-73c71759c49d).html

Abstract

Mass extrusion occurs in electromigration at the anode in cross-sectioned Sn-0.7Cu flip-chip solder joints. In a pair of joints, the hillock squeezed out at the anode on the board side is more serious than the whisker grown at the anode on the chip side. The difference of mass extrusion has been found to be affected by the amount of intermetallic compound (IMC) formation in the solder bump. It is found that when a large amount of Cu-Sn IMCs form in the grain boundaries of Sn grains, small hillocks are extruded on the anode end. It is proposed that the excessive IMC formation may be able to block the diffusion path of Sn atoms, so the growth of both the Sn whiskers and hillocks are retarded. © 2010 American Institute of Physics.

Bibliographic Note

Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

Citation Format(s)

[ RIS ] [ BibTeX ]

Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration. / Liang, S. W.; Chen, Chih; Han, J. K. et al.
In: Journal of Applied Physics, Vol. 107, No. 9, 093715, 01.05.2010.

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

Liang, SW, Chen, C, Han, JK, Xu, L, Tu, KN & Lai, Y-S 2010, 'Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration', Journal of Applied Physics, vol. 107, no. 9, 093715. https://doi.org/10.1063/1.3410796

Liang, S. W., Chen, C., Han, J. K., Xu, L., Tu, K. N., & Lai, Y.-S. (2010). Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration. Journal of Applied Physics, 107(9), Article 093715. https://doi.org/10.1063/1.3410796

Liang SW, Chen C, Han JK, Xu L, Tu KN, Lai YS. Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration. Journal of Applied Physics. 2010 May 1;107(9):093715. doi: 10.1063/1.3410796

Liang, S. W. ; Chen, Chih ; Han, J. K. et al. / Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration. In: Journal of Applied Physics. 2010 ; Vol. 107, No. 9.