TY - JOUR
T1 - Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration
AU - Liang, S. W.
AU - Chen, Chih
AU - Han, J. K.
AU - Xu, Luhua
AU - Tu, K. N.
AU - Lai, Yi-Shao
N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].
PY - 2010/5/1
Y1 - 2010/5/1
N2 - Mass extrusion occurs in electromigration at the anode in cross-sectioned Sn-0.7Cu flip-chip solder joints. In a pair of joints, the hillock squeezed out at the anode on the board side is more serious than the whisker grown at the anode on the chip side. The difference of mass extrusion has been found to be affected by the amount of intermetallic compound (IMC) formation in the solder bump. It is found that when a large amount of Cu-Sn IMCs form in the grain boundaries of Sn grains, small hillocks are extruded on the anode end. It is proposed that the excessive IMC formation may be able to block the diffusion path of Sn atoms, so the growth of both the Sn whiskers and hillocks are retarded. © 2010 American Institute of Physics.
AB - Mass extrusion occurs in electromigration at the anode in cross-sectioned Sn-0.7Cu flip-chip solder joints. In a pair of joints, the hillock squeezed out at the anode on the board side is more serious than the whisker grown at the anode on the chip side. The difference of mass extrusion has been found to be affected by the amount of intermetallic compound (IMC) formation in the solder bump. It is found that when a large amount of Cu-Sn IMCs form in the grain boundaries of Sn grains, small hillocks are extruded on the anode end. It is proposed that the excessive IMC formation may be able to block the diffusion path of Sn atoms, so the growth of both the Sn whiskers and hillocks are retarded. © 2010 American Institute of Physics.
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U2 - 10.1063/1.3410796
DO - 10.1063/1.3410796
M3 - RGC 21 - Publication in refereed journal
SN - 0021-8979
VL - 107
JO - Journal of Applied Physics
JF - Journal of Applied Physics
IS - 9
M1 - 093715
ER -