Abstract
Polydopamine (PDA) has been extensively investigated due to its excellent adhesion ability and versatile chemical potential for secondary reactions. However, the potential application of hollow polydopamine microspheres (H-PDA) in the field of low-dielectric electronic packaging remains an unexplored area. Here, H-PDA microspheres with adjustable size were synthesized by a template-assisted approach, and the influence of size and content of H-PDA on the comprehensive performance of PI/H-PDA composites was explored in detail. The morphology observation revealed that the presence of H-PDA could be homogeneously dispersed in the PI matrix, and the PI/H-PDA composite containing 2 wt% H-PDA-800 achieved the lowest dielectric constant of 1.96 with a dielectric loss of 0.0123 at 1 MHz. It was attributed to the synergistic effects of nano-sized air bubbles from H-PDA and the dielectric confinement effect. Meanwhile, PI/H-PDA composites maintained high thermal stability (T5 > 517 °C). In addition, the incorporation of H-PDA had a strengthening and toughening effect on PI composites, which can be explained by the sliding theory of macromolecular chains. This work offers a feasible strategy to obtain ultra-low dielectric constant of porous PI composites while maintaining good mechanical properties and thermal stability. © 2023 Elsevier B.V.
| Original language | English |
|---|---|
| Article number | 158714 |
| Journal | Applied Surface Science |
| Volume | 643 |
| Online published | 19 Oct 2023 |
| DOIs | |
| Publication status | Published - 15 Jan 2024 |
Research Keywords
- Hollow polydopamine microspheres
- Low dielectric
- Polyimide
- Thermal stability
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