Bestow metal foams with nanostructured surfaces via a convenient electrochemical method for improved device performance

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

11 Scopus Citations
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Original languageEnglish
Pages (from-to)2364-2371
Journal / PublicationNano Research
Issue number8
Online published31 May 2016
Publication statusPublished - Aug 2016


Metal foams have been intensively studied as three-dimensional (3-D) bulk mass-support for various applications because of their high conductivities and attractive mechanical properties. However, the relatively low surface area of conventional metal foams largely limits their performance in applications such as charge storage. Here, we present a convenient electrochemical method for addressing this problem using Cu foams as an example. High surface area Cu foams are fabricated in a one-pot one-step manner by repetitive electrodeposition and dealloying treatments. The obtained Cu foams exhibit greatly improved performance for different applications like surface enhanced Raman spectroscopy (SERS) substrates and 3-D bulk supercapacitor electrodes. [Figure not available: see fulltext.]

Research Area(s)

  • dealloying, electrodeposition, metal foams, supercapacitors, surface enhanced Raman spectroscopy substrates