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Author Correction: Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder 

  • Yu-An Shen
  • , Chun-Ming Lin
  • , Jiahui Li
  • , Siliang He
  • , Hiroshi Nishikawa

Research output: Journal Publications and Reviews › Erratum

32 Downloads (CityUHK Scholars)

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