Author Correction: Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder

Yu-An Shen; Chun-Ming Lin; Jiahui Li; Siliang He; Hiroshi Nishikawa

doi:10.1038/s41598-020-67126-y

Author Correction: Effect of FeCoNiCrCu_0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder

Yu-An Shen
, Chun-Ming Lin
, Jiahui Li
, Siliang He
, Hiroshi Nishikawa

Department of Electrical Engineering

Research output: Journal Publications and Reviews › Erratum

30 Downloads (CityUHK Scholars)

Abstract

Correct to: Scientific Reports https://doi.org/10.1038/s41598-019-40268-4, published online 06 March 2019

In the Supplementary Information file originally published with this Article, some text was inappropriately used and cited. These errors have been corrected in the Supplementary Information that now accompanies the Article.

Original language	English
Article number	12229
Journal	Scientific Reports
Volume	10
Online published	22 Jul 2020
DOIs	https://doi.org/10.1038/s41598-020-67126-y
Publication status	Published - 2020

Publisher's Copyright Statement

This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format.

Access Output

10.1038/s41598-020-67126-y

55374935.pdfFinal Published version, 625 KBLicence: CC BY

Other Access Options

Check CityUHK Library

Permanent Link

Right click to copy link

Cite this

@article{12f7539d0c44497a92cb8487e2b2a715,

title = "Author Correction: Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder ",

abstract = "Correct to: Scientific Reports https://doi.org/10.1038/s41598-019-40268-4, published online 06 March 2019 In the Supplementary Information file originally published with this Article, some text was inappropriately used and cited. These errors have been corrected in the Supplementary Information that now accompanies the Article.",

author = "Yu-An Shen and Chun-Ming Lin and Jiahui Li and Siliang He and Hiroshi Nishikawa",

year = "2020",

doi = "10.1038/s41598-020-67126-y",

language = "English",

volume = "10",

journal = "Scientific Reports",

issn = "2045-2322",

publisher = "Nature Publishing Group",

}

TY - JOUR

T1 - Author Correction

T2 - Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder

AU - Shen, Yu-An

AU - Lin, Chun-Ming

AU - Li, Jiahui

AU - He, Siliang

AU - Nishikawa, Hiroshi

PY - 2020

Y1 - 2020

N2 - Correct to: Scientific Reports https://doi.org/10.1038/s41598-019-40268-4, published online 06 March 2019 In the Supplementary Information file originally published with this Article, some text was inappropriately used and cited. These errors have been corrected in the Supplementary Information that now accompanies the Article.

AB - Correct to: Scientific Reports https://doi.org/10.1038/s41598-019-40268-4, published online 06 March 2019 In the Supplementary Information file originally published with this Article, some text was inappropriately used and cited. These errors have been corrected in the Supplementary Information that now accompanies the Article.

UR - https://www.scopus.com/pages/publications/85088386542

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-85088386542&origin=recordpage

U2 - 10.1038/s41598-020-67126-y

DO - 10.1038/s41598-020-67126-y

M3 - Erratum

C2 - 32699303

SN - 2045-2322

VL - 10

JO - Scientific Reports

JF - Scientific Reports

M1 - 12229

ER -