Author Correction: Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder 

Yu-An Shen, Chun-Ming Lin, Jiahui Li, Siliang He, Hiroshi Nishikawa

Research output: Journal Publications and ReviewsErratum

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Abstract

Correct to: Scientific Reports https://doi.org/10.1038/s41598-019-40268-4, published online 06 March 2019 

In the Supplementary Information file originally published with this Article, some text was inappropriately used and cited. These errors have been corrected in the Supplementary Information that now accompanies the Article.
Original languageEnglish
Article number12229
JournalScientific Reports
Volume10
Online published22 Jul 2020
DOIs
Publication statusPublished - 2020

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