Asymmetrical growth of Cu6Sn5 intermetallic compounds due to rapid thermomigration of Cu in molten SnAg solder joints

Ming-Yung Guo; C.K. Lin; Chih Chen; K.N. Tu

doi:10.1016/j.intermet.2012.06.003

Asymmetrical growth of Cu₆Sn₅ intermetallic compounds due to rapid thermomigration of Cu in molten SnAg solder joints

Ming-Yung Guo
, C.K. Lin
, Chih Chen^*
, K.N. Tu

^*Corresponding author for this work

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

68 Citations (Scopus)

Abstract

We observed asymmetrical growth of Cu₆Sn₅ intermetallic compounds (IMCs) on the two interfaces of Cu/SnAg/Cu solder joints during reflow at 260 °C on a hot plate. The IMCs grew to 12.3 μm on the cold end and 3.5 μm on the hot end after reflow for 40 min. However, the consumption of Cu on the cold end is less than that on the hot end. We propose that rapid thermomigration of Cu is responsible for the asymmetrical growth of the IMCs. With the simulated thermal gradient of 51 °C/cm across the liquid solder, the heat of transport of Cu is calculated as 20 kJ/mol. © 2012 Elsevier Ltd. All rights reserved.

Original language	English
Pages (from-to)	155-158
Journal	Intermetallics
Volume	29
DOIs	https://doi.org/10.1016/j.intermet.2012.06.003
Publication status	Published - Oct 2012
Externally published	Yes

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Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

Research Keywords

A. Intermetallics, miscellaneous
B. Diffusion
B. Thermal properties
C. Joining

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Cite this

@article{15b80276d03a4800900e7d48c97d1ecb,

title = "Asymmetrical growth of Cu6Sn5 intermetallic compounds due to rapid thermomigration of Cu in molten SnAg solder joints",

abstract = "We observed asymmetrical growth of Cu6Sn5 intermetallic compounds (IMCs) on the two interfaces of Cu/SnAg/Cu solder joints during reflow at 260 °C on a hot plate. The IMCs grew to 12.3 μm on the cold end and 3.5 μm on the hot end after reflow for 40 min. However, the consumption of Cu on the cold end is less than that on the hot end. We propose that rapid thermomigration of Cu is responsible for the asymmetrical growth of the IMCs. With the simulated thermal gradient of 51 °C/cm across the liquid solder, the heat of transport of Cu is calculated as 20 kJ/mol. {\textcopyright} 2012 Elsevier Ltd. All rights reserved.",

keywords = "A. Intermetallics, miscellaneous, B. Diffusion, B. Thermal properties, C. Joining",

author = "Ming-Yung Guo and C.K. Lin and Chih Chen and K.N. Tu",

note = "Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].",

year = "2012",

month = oct,

doi = "10.1016/j.intermet.2012.06.003",

language = "English",

volume = "29",

pages = "155--158",

journal = "Intermetallics",

issn = "0966-9795",

publisher = "Elsevier Ltd.",

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TY - JOUR

T1 - Asymmetrical growth of Cu6Sn5 intermetallic compounds due to rapid thermomigration of Cu in molten SnAg solder joints

AU - Guo, Ming-Yung

AU - Lin, C.K.

AU - Chen, Chih

AU - Tu, K.N.

N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

PY - 2012/10

Y1 - 2012/10

N2 - We observed asymmetrical growth of Cu6Sn5 intermetallic compounds (IMCs) on the two interfaces of Cu/SnAg/Cu solder joints during reflow at 260 °C on a hot plate. The IMCs grew to 12.3 μm on the cold end and 3.5 μm on the hot end after reflow for 40 min. However, the consumption of Cu on the cold end is less than that on the hot end. We propose that rapid thermomigration of Cu is responsible for the asymmetrical growth of the IMCs. With the simulated thermal gradient of 51 °C/cm across the liquid solder, the heat of transport of Cu is calculated as 20 kJ/mol. © 2012 Elsevier Ltd. All rights reserved.

AB - We observed asymmetrical growth of Cu6Sn5 intermetallic compounds (IMCs) on the two interfaces of Cu/SnAg/Cu solder joints during reflow at 260 °C on a hot plate. The IMCs grew to 12.3 μm on the cold end and 3.5 μm on the hot end after reflow for 40 min. However, the consumption of Cu on the cold end is less than that on the hot end. We propose that rapid thermomigration of Cu is responsible for the asymmetrical growth of the IMCs. With the simulated thermal gradient of 51 °C/cm across the liquid solder, the heat of transport of Cu is calculated as 20 kJ/mol. © 2012 Elsevier Ltd. All rights reserved.

KW - A. Intermetallics, miscellaneous

KW - B. Diffusion

KW - B. Thermal properties

KW - C. Joining

UR - https://www.scopus.com/pages/publications/84863986022

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-84863986022&origin=recordpage

U2 - 10.1016/j.intermet.2012.06.003

DO - 10.1016/j.intermet.2012.06.003

M3 - RGC 21 - Publication in refereed journal

SN - 0966-9795

VL - 29

SP - 155

EP - 158

JO - Intermetallics

JF - Intermetallics

ER -