Assembly of three-dimensional microsystems using a hybrid manipulation strategy

Precise manipulation and attachment method is of fundamental importance in the development of complex microsystems. In this work, we describe a hybrid manipulation strategy to assemble three-dimensional microsystems, in which a pick-and-place strategy and a pushing-based operation are combined together to accurately position and assemble microparts. Pick-and-place operations flexibly position microparts to a desired location. Pushing-based manipulation precisely adjusts the orientations of microparts. An adhesive mechanical fastener, which includes a self-aligned snap-lock mechanism and a curable adhesive bonding, is developed to attach microparts. First, the pick-and-place operations flexibly position and join microparts using a snap-lock mechanism. Then, fine adjustments of the orientation of joined microparts are carried out using a pushing-based strategy. Finally, curing light is applied to harden the adhesive. The hybrid strategy has the advantage of precise and flexible positioning microparts. In addition, solid mechanical joints and reliable electrical connections are achievable. To demonstrate the feasibility of this method, a three-dimensional rotary optical switch has been assembled. © 2008 IEEE.