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Artificial Intelligence-Assisted Bioinformatics, Microneedle, and Diabetic Wound Healing: A "New Deal" of an Old Drug

Yanan Xue, Cheng Chen, Rong Tan, Jingyu Zhang, Qin Fang, Rui Jin, Xiangyu Mi, Danying Sun, Yinan Xue, Yue Wang, Rong Xiong, Haojian Lu*, Weiqiang Tan*

*Corresponding author for this work

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

Abstract

Diabetic wounds severely influence life, facing grand challenges in clinical treatments. The demand for better treatment is growing dramatically. Diabetic wound healing is challenging because of inflammation, angiogenesis disruptions, and tissue remodeling. Based on sequencing results of diabetic patients' skins and artificial intelligence (AI)-assisted bioinformatics, we excavate a potential therapeutic agent Trichostatin A (TSA) and a potential target histone deacetylase 4 (HDAC4) for diabetic wound healing. The molecular docking simulation reveals the favorable interaction between TSA and HDAC4. Taking advantage of the microneedle (MN) minimally invasive way to pierce the skin barrier for drug administration, we develop a swelling modified MN-mediated patch loaded with TSA to reduce the probability of injection-caused iatrogenic secondary damage. The MN-mediated TSA patch has been demonstrated to reduce inflammation, promote tissue regeneration, and inhibit HDAC4, which provides superior results in diabetic wound healing. We envisage that our explored specific drug TSA and the related MN-mediated drug delivery system can provide an innovative approach for diabetic wound treatment with simple, effective, and safe features and find a broad spectrum of applications in related biomedical fields.
Original languageEnglish
Pages (from-to)37396–37409
JournalACS Applied Materials and Interfaces
Volume14
Issue number33
Online published1 Aug 2022
DOIs
Publication statusPublished - 24 Aug 2022

Research Keywords

  • artificial intelligence
  • bioinformatics
  • diabetic wounds
  • microneedle
  • Trichostatin A

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