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Application of high-quality SiO2 grown by multipolar ECR source to Si/SiGe MISFET

  • K. T. Sung
  • , W. Q. Li
  • , S. H. Li
  • , S. W. Pang
  • , P. K. Bhattacharya

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

Abstract

A 5 nm-thick SiO2 gate was grown on an Si (p+)/Si0.8Ge0.2 modulation-doped heterostructure at 26°C with an oxygen plasma generated by a multipolar electron cyclotron resonance source. The ultrathin oxide has breakdown field > 12 MV/cm and fixed charge density approx. 3 × 1010 cm-2. Leakage current as low as 1 μA was obtained with the gate biased at 4 V. The MISFET with 0.25 × 25 μm2 gate shows maximum drain current of 41.6 mA/mm and peak transconductance of 21 mS/mm.
Original languageEnglish
Pages (from-to)277-278
JournalElectronics Letters
Volume29
Issue number3
DOIs
Publication statusPublished - 4 Feb 1993
Externally publishedYes

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