Application of Adhesive bonding techniques in Hard Disk Drive head assembly

C. F. Luk; Y. C. Chan; K. C. Hung

Application of Adhesive bonding techniques in Hard Disk Drive head assembly

C. F. Luk, Y. C. Chan, K. C. Hung

Department of Electrical Engineering

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

Abstract

Current market conditions demand that hard disk drive (HDD) manufacturers adopt advanced technology in every area of drive design to improve drive capacity and performance while simultaneously reduces unit cost. Like all the vendors to the HDD industry, Head stack suppliers for HDD are constantly working on High Density Interconnect (HDI) technologies to provide solutions that enable faster, higher capacity, more economical disk drives. This paper will describe a low cost method to manufacture HDD head using Anisotropic Conductive Film (ACF) bonding for Flex to Flex interconnection. It appears that this type of adhesives can give a very reliable electrical and mechanical interconnection.

Original language	English
Title of host publication	Advances in Electronic Packaging
Pages	191-198
Volume	1
Publication status	Published - 2001
Event	Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition - Kauai, Hi, United States Duration: 8 Jul 2001 → 13 Jul 2001

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Name
Volume	1

Conference

Conference	Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition
Place	United States
City	Kauai, Hi
Period	8/07/01 → 13/07/01

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SDG 9 Industry, Innovation, and Infrastructure

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title = "Application of Adhesive bonding techniques in Hard Disk Drive head assembly",

abstract = "Current market conditions demand that hard disk drive (HDD) manufacturers adopt advanced technology in every area of drive design to improve drive capacity and performance while simultaneously reduces unit cost. Like all the vendors to the HDD industry, Head stack suppliers for HDD are constantly working on High Density Interconnect (HDI) technologies to provide solutions that enable faster, higher capacity, more economical disk drives. This paper will describe a low cost method to manufacture HDD head using Anisotropic Conductive Film (ACF) bonding for Flex to Flex interconnection. It appears that this type of adhesives can give a very reliable electrical and mechanical interconnection.",

author = "Luk, {C. F.} and Chan, {Y. C.} and Hung, {K. C.}",

year = "2001",

language = "English",

isbn = "791835405",

volume = "1",

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booktitle = "Advances in Electronic Packaging",

note = "Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition ; Conference date: 08-07-2001 Through 13-07-2001",

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AU - Chan, Y. C.

AU - Hung, K. C.

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N2 - Current market conditions demand that hard disk drive (HDD) manufacturers adopt advanced technology in every area of drive design to improve drive capacity and performance while simultaneously reduces unit cost. Like all the vendors to the HDD industry, Head stack suppliers for HDD are constantly working on High Density Interconnect (HDI) technologies to provide solutions that enable faster, higher capacity, more economical disk drives. This paper will describe a low cost method to manufacture HDD head using Anisotropic Conductive Film (ACF) bonding for Flex to Flex interconnection. It appears that this type of adhesives can give a very reliable electrical and mechanical interconnection.

AB - Current market conditions demand that hard disk drive (HDD) manufacturers adopt advanced technology in every area of drive design to improve drive capacity and performance while simultaneously reduces unit cost. Like all the vendors to the HDD industry, Head stack suppliers for HDD are constantly working on High Density Interconnect (HDI) technologies to provide solutions that enable faster, higher capacity, more economical disk drives. This paper will describe a low cost method to manufacture HDD head using Anisotropic Conductive Film (ACF) bonding for Flex to Flex interconnection. It appears that this type of adhesives can give a very reliable electrical and mechanical interconnection.

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UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-0348199310&origin=recordpage

M3 - RGC 32 - Refereed conference paper (with host publication)

SN - 791835405

VL - 1

SP - 191

EP - 198

BT - Advances in Electronic Packaging

T2 - Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition

Y2 - 8 July 2001 through 13 July 2001

ER -

Application of Adhesive bonding techniques in Hard Disk Drive head assembly

Abstract

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