TY - GEN
T1 - Analyzing the performance of flexible substrates for lead-free applications
AU - Yin, C. Y.
AU - Lu, H.
AU - Bailey, C.
AU - Chan, Y. C.
PY - 2006
Y1 - 2006
N2 - The performance of flexible substrates for lead-free applications was studied using Finite Element Method (FEM). Firstly, the thermal induced stress in the flex substrate during the lead free solder reflow process was predicted. The shear stress at the interface between the copper track and flex was plotted. This shear stress increases with the thickness of the copper track and the thickness of the flex. Secondly, an anisotropic conductive film (ACF) flip chip was taken as a typical lead-free application of the flex substrate and the moisture effect on the reliability of ACF joints were studied using a 3D macro-micro modeling technique. It is found that the time to be saturated of an ACF flip chip is much dependent on the moisture diffusion rate in the polyimide substrate. The majority moisture diffuses into the ACF layer from the substrate side rather than the periphery of the ACF. The moisture induced stress was predicted and the predominant tensile stress was found at the interface between the conductive particle and metallization which could reduce the contact area and even cause the electrical failure. © 2006 IEEE.
AB - The performance of flexible substrates for lead-free applications was studied using Finite Element Method (FEM). Firstly, the thermal induced stress in the flex substrate during the lead free solder reflow process was predicted. The shear stress at the interface between the copper track and flex was plotted. This shear stress increases with the thickness of the copper track and the thickness of the flex. Secondly, an anisotropic conductive film (ACF) flip chip was taken as a typical lead-free application of the flex substrate and the moisture effect on the reliability of ACF joints were studied using a 3D macro-micro modeling technique. It is found that the time to be saturated of an ACF flip chip is much dependent on the moisture diffusion rate in the polyimide substrate. The majority moisture diffuses into the ACF layer from the substrate side rather than the periphery of the ACF. The moisture induced stress was predicted and the predominant tensile stress was found at the interface between the conductive particle and metallization which could reduce the contact area and even cause the electrical failure. © 2006 IEEE.
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UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-33847173409&origin=recordpage
U2 - 10.1109/ESIME.2006.1644052
DO - 10.1109/ESIME.2006.1644052
M3 - RGC 32 - Refereed conference paper (with host publication)
SN - 1424402751
SN - 9781424402755
VL - 2006
BT - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006
T2 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006
Y2 - 24 April 2006 through 26 April 2006
ER -