Analytical solution for the bond strength of externally bonded reinforcement

Yu-Fei Wu, Xin-Sheng Xu, Jia-Bin Sun, Cheng Jiang

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    109 Citations (Scopus)

    Abstract

    Interfacial behavior is critical to composite structures and materials reinforced by externally bonded reinforcement. Numerous empirical and semi-empirical models have been developed for evaluating interfacial bond strength. Analytical solutions have been derived for interfaces with infinite bond lengths, but no closed-form solutions have been derived for the bond strength of an interface with an arbitrary bond length. An analytical solution is derived in this work for the strength of a general externally bonded interface. With the analytical method, the interesting snapback phenomenon in simple pull-off tests is theoretically studied, and an invariant is identified as the condition for it to occur. Furthermore, a methodology is provided to evaluate the interfacial material properties based on a given empirical bond model. © 2012 Elsevier Ltd.
    Original languageEnglish
    Pages (from-to)3232-3239
    JournalComposite Structures
    Volume94
    Issue number11
    DOIs
    Publication statusPublished - Nov 2012

    Research Keywords

    • Adhesion
    • Analytical modeling
    • Debonding
    • Interface

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