Analytical modeling of reservoir effect on electromigration in Cu interconnects

Zhenghao Gan^*, A. M. Gusak, W. Shao, Zhong Chen, S. G. Mhaisalkar, T. Zaporozhets, K. N. Tu

^*Corresponding author for this work

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review