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Analysis of Mode II debonding behavior of fiber-reinforced polymer-to-substrate bonded joints subjected to combined thermal and mechanical loading

  • Wan-Yang Gao
  • , Jian-Guo Dai*
  • , J.G. Teng
  • *Corresponding author for this work

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

Abstract

This paper presents a set of closed-form solutions for Mode II debonding process of fiber-reinforced polymer-to-substrate bonded joints subjected to combined thermal and mechanical loading. Six different bond-slip models are considered in deriving the closed-form solutions. For each bond-slip model, explicit expressions for the debonding load, effective bond length, interfacial shear stress, interfacial slip as well as the load-displacement response are presented. Provided the bond length is sufficiently long, the debonding load depends only on the interfacial fracture energy and the temperature variation. A temperature increase leads to an increase in both the debonding load and the effective bond length, and the rate of increase of the latter depends on the bond-slip model of the interface. © 2015 Elsevier Ltd.
Original languageEnglish
Pages (from-to)241-264
Number of pages24
JournalEngineering Fracture Mechanics
Volume136
Online published11 Feb 2015
DOIs
Publication statusPublished - Mar 2015
Externally publishedYes

Funding

The authors are grateful for the financial support received from the National Basic Research Program of China (i.e. the 973 Program) (Project No.: 2012CB026201 ) and the National Natural Science Foundation of China (NSFC) (Project Nos: 51478406 and 51408521 ). They are also grateful for a Postdoctoral fellowship awarded to the first author by The Hong Kong Polytechnic University.

Research Keywords

  • Bond-slip model
  • Concrete
  • Debonding
  • Effective bond length
  • Fiber reinforced polymer (FRP)
  • Interface
  • Steel
  • Substrate
  • Temperature variation

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