An thermal modeling method of the magnetic coupler in inductive power transfer application

Research output: Patents, Agreements and Assignments › RGC 51 - Patents (CityUHK)

Overview

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Author(s)

Weisheng GUO (Inventor)
Chaoqiang JIANG (Inventor)
Yibo WANG (Inventor)
Xiaosheng WANG (Inventor)

Related Research Unit(s)

Department of Electrical Engineering

Detail(s)

Original language	English
Filing number	63/730,440
Publication status	Accepted/In press/Filed - 10 Dec 2024

Link(s)

	Check@CityULib
Permanent Link	https://scholars.cityu.edu.hk/en/publications/publication(a29b368d-6a63-4cdc-b55d-ebbf65e30521).html

Citation Format(s)

[ RIS ] [ BibTeX ]

An thermal modeling method of the magnetic coupler in inductive power transfer application. / GUO, Weisheng (Inventor); JIANG, Chaoqiang (Inventor); WANG, Yibo (Inventor) et al.
Dec 10, 2024.

Research output: Patents, Agreements and Assignments › RGC 51 - Patents (CityUHK)

GUO, W, JIANG, C , WANG, Y & WANG, X Dec. 10 2024, An thermal modeling method of the magnetic coupler in inductive power transfer application.

GUO, W., JIANG, C., WANG, Y., & WANG, X. (in press). An thermal modeling method of the magnetic coupler in inductive power transfer application.

GUO W, JIANG C , WANG Y , WANG X, inventors. An thermal modeling method of the magnetic coupler in inductive power transfer application. 2024 Dec 10.

GUO, Weisheng (Inventor) ; JIANG, Chaoqiang (Inventor) ; WANG, Yibo (Inventor) et al. / An thermal modeling method of the magnetic coupler in inductive power transfer application. Dec 10, 2024.