An overview of manufacturing yield and reliability modeling for semiconductor products

Way Kuo; Taeho Kim

doi:10.1109/5.775417

Author(s)

Way Kuo
Taeho Kim

Detail(s)

Original language	English
Pages (from-to)	1329-1344
Journal / Publication	Proceedings of the IEEE
Volume	87
Issue number	8
Publication status	Published - 1999
Externally published	Yes

Link(s)

DOI	DOI https://doi.org/10.1109/5.775417 Final Published version
	Check@CityULib
Link to Scopus	https://www.scopus.com/record/display.uri?eid=2-s2.0-0032628982&origin=recordpage
Permanent Link	https://scholars.cityu.edu.hk/en/publications/publication(55d9ddf0-7179-44b0-bb0a-5acd1c955a49).html

Abstract

This paper presents an overview of yield, reliability, burn-in, cost factors, and fault coverage as practiced in the semiconductor manufacturing industry. Reliability and yield modeling can be used as a foundation for developing effective stress burn-in, which in turn can warranty high-quality semiconductor products. Yield models are described and their advantages and disadvantages are discussed. Both yield-reliability relationships and relation models bet\veen yield and reliability are thoroughly analyzed in regard to their importance to semiconductor products. © 1999 IEEE.

Research Area(s)

Fault coverage, Package level burn-in, Semiconductor yield, Wafer level burn-in, Yield-reliability relation

Citation Format(s)

[ RIS ] [ BibTeX ]

An overview of manufacturing yield and reliability modeling for semiconductor products. / Kuo, Way; Kim, Taeho.
In: Proceedings of the IEEE, Vol. 87, No. 8, 1999, p. 1329-1344.

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

Kuo, W & Kim, T 1999, 'An overview of manufacturing yield and reliability modeling for semiconductor products', Proceedings of the IEEE, vol. 87, no. 8, pp. 1329-1344. https://doi.org/10.1109/5.775417

Kuo, W., & Kim, T. (1999). An overview of manufacturing yield and reliability modeling for semiconductor products. Proceedings of the IEEE, 87(8), 1329-1344. https://doi.org/10.1109/5.775417

Kuo W, Kim T. An overview of manufacturing yield and reliability modeling for semiconductor products. Proceedings of the IEEE. 1999;87(8):1329-1344. doi: 10.1109/5.775417

Kuo, Way ; Kim, Taeho. / An overview of manufacturing yield and reliability modeling for semiconductor products. In: Proceedings of the IEEE. 1999 ; Vol. 87, No. 8. pp. 1329-1344.