An overview of manufacturing yield and reliability modeling for semiconductor products

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Original languageEnglish
Pages (from-to)1329-1344
Journal / PublicationProceedings of the IEEE
Issue number8
Publication statusPublished - 1999
Externally publishedYes


This paper presents an overview of yield, reliability, burn-in, cost factors, and fault coverage as practiced in the semiconductor manufacturing industry. Reliability and yield modeling can be used as a foundation for developing effective stress burn-in, which in turn can warranty high-quality semiconductor products. Yield models are described and their advantages and disadvantages are discussed. Both yield-reliability relationships and relation models bet\veen yield and reliability are thoroughly analyzed in regard to their importance to semiconductor products. © 1999 IEEE.

Research Area(s)

  • Fault coverage, Package level burn-in, Semiconductor yield, Wafer level burn-in, Yield-reliability relation