TY - JOUR
T1 - An Equivalent Circuit Model With Current Return Path Effects for ON-Chip Interconnect up to 80 GHz
AU - Zhu, Yukun
AU - Kang, Kai
AU - Wu, Yunqiu
AU - Zhao, Chenxi
AU - Ban, Yong-Ling
AU - Guo, Jinhong
AU - Sun, Ling Ling
AU - Yin, Wen-Yan
AU - Xue, Quan
PY - 2015/9/1
Y1 - 2015/9/1
N2 - A lumped-element model for ON-chip interconnects is proposed in this paper. The effect of current return path of interconnects is analyzed. An efficient analytical parameter extraction method for the model is proposed. The inductor Lg was adopted in the shunt branch of this model to characterize the induced time-varying magnetic field. Thus, the bandwidth of the model is extended over the resonance frequency. A group of interconnects with different structures were fabricated in a 0.18-μm CMOS process to investigate the effects of current return path. The good agreement of S-parameters between the model and measurements suggests that the proposed model can accurately predict the performance of interconnect in a wide frequency band up to 80 GHz, even over the resonance frequency.
AB - A lumped-element model for ON-chip interconnects is proposed in this paper. The effect of current return path of interconnects is analyzed. An efficient analytical parameter extraction method for the model is proposed. The inductor Lg was adopted in the shunt branch of this model to characterize the induced time-varying magnetic field. Thus, the bandwidth of the model is extended over the resonance frequency. A group of interconnects with different structures were fabricated in a 0.18-μm CMOS process to investigate the effects of current return path. The good agreement of S-parameters between the model and measurements suggests that the proposed model can accurately predict the performance of interconnect in a wide frequency band up to 80 GHz, even over the resonance frequency.
KW - Compact model
KW - equivalent circuit model
KW - millimeter wave
KW - ON-chip interconnect
KW - wideband
UR - http://www.scopus.com/inward/record.url?scp=84942802012&partnerID=8YFLogxK
UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-84942802012&origin=recordpage
U2 - 10.1109/TCPMT.2015.2448572
DO - 10.1109/TCPMT.2015.2448572
M3 - RGC 21 - Publication in refereed journal
SN - 2156-3950
VL - 5
SP - 1320
EP - 1330
JO - IEEE Transactions on Components, Packaging and Manufacturing Technology
JF - IEEE Transactions on Components, Packaging and Manufacturing Technology
IS - 9
M1 - 7226794
ER -