An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

38 Scopus Citations
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Author(s)

  • Weiqiang Wang
  • Anupam Choubey
  • Michael H. Azarian
  • Michael Pecht

Detail(s)

Original languageEnglish
Pages (from-to)815-827
Journal / PublicationJournal of Electronic Materials
Volume38
Issue number6
Online published14 Apr 2009
Publication statusPublished - Jun 2009

Conference

Title50th Electronic Materials Conference
PlaceCanada
CitySanta Barbara
Period1 June 2008

Abstract

The worldwide transition to lead-free electronics has increased the usage of several lead-free pad finishes for electronic assembly manufacturers, including immersion silver, immersion tin, electroless nickel-immersion gold, and organic solderability preservatives. This study assesses and compares immersion silver as a circuit board finish in terms of its ease of use, wettability, solderability, shelf life, appearance, solder joint strength, intermetallic and void formation, reliability, and costs.

Research Area(s)

  • Immersion silver, surface finish, lead-free, circuit board, FREE SOLDER JOINTS, PACKAGING TECHNOLOGY, TIN, HUMIDITY, SOLDERABILITY, TEMPERATURE, PERFORMANCE, BOARDS, GOLD

Bibliographic Note

Full text of this publication does not contain sufficient affiliation information. With consent from the author(s) concerned, the Research Unit(s) information for this record is based on the existing academic department affiliation of the author(s).

Citation Format(s)

An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics. / Wang, Weiqiang; Choubey, Anupam; Azarian, Michael H. et al.
In: Journal of Electronic Materials, Vol. 38, No. 6, 06.2009, p. 815-827.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review