An analytical study on steam-driven delamination and stability of delamination growth in electronic packages

In this study, elliptic interfacial defects between the molding compound and the substrate in electronic packages are analytically modeled to investigate delamination growth direction and delamination growth stability. Approximate solutions of strain energy release rate for three delamination patterns are derived based on Reissner-Mindlin plate theory and the solution of an elliptic crack embedded in an infinite solid. These solutions reveal that an elliptic defect is expected to grow into a circular crack along the minor-axis. The results of this study can be used for predicting critical defect sizes or temperatures and evaluating reliability of electronic packages.