An active interface pressure adapter for enhancing sensing capacity and stability of wearable electronics

Jian Li, Xinge Yu*

*Corresponding author for this work

Research output: Chapters, Conference Papers, Creative and Literary WorksRGC 32 - Refereed conference paper (with host publication)peer-review

Abstract

Wearable hybrid systems offer the potential for continuous and reliable on-skin monitoring of physiological indicators. These systems typically consist of sensing modules, signal processing modules, and protective encapsulation modules, shielding the systems from external environments to enhance their robustness, which in turn compromises interfacial stability. To address this challenge, we introduce a novel interface pressure adapter designed to significantly improve the compliance and stability between the user's skin and the wearable system. This adapter incorporates a micro-Airbag, a pressure regulation one-way valve, and a micro-pump, working in synergy to provide sufficient pressure support to the sensing module, thereby enhancing the sensing stability and robustness of wearable systems. As proof of concept, a maximum pressure of 16.2 kPa was generated and regulated with 5 pumping phases to provide back pressure to a pressure sensor for pulse wave measurement. The proposed adapter demonstrated remarkable improvements in interfacial stability and measurement robustness against various joint deformation and motion artifacts. This design presents a promising solution for enhancing the performance and interface stability of contact-based sensing systems. © 2024 IEEE.
Original languageEnglish
Title of host publication2024 IEEE 3rd International Conference on Micro/Nano Sensors for AI, Healthcare and Robotics (NSENS)
PublisherIEEE
Pages45-48
ISBN (Electronic)979-8-3503-7521-3
DOIs
Publication statusPublished - 2024
Event3rd IEEE International Conference on Micro/Nano Sensors for AI, Healthcare and Robotics (IEEE-NSENS 2024) - Shenzhen Convention and Exhibition Center, Shenzhen, China
Duration: 2 Mar 20243 Mar 2024
https://www.ieeensens.org/

Publication series

NameProceedings of the IEEE International Conference on Micro/Nano Sensors for AI, Healthcare and Robotics, NSENS

Conference

Conference3rd IEEE International Conference on Micro/Nano Sensors for AI, Healthcare and Robotics (IEEE-NSENS 2024)
Abbreviated titleNSENS 2024
PlaceChina
CityShenzhen
Period2/03/243/03/24
Internet address

Funding

This work was supported by InnoHK Project on Project 2.2—AI-based 3D ultrasound imaging algorithm at Hong Kong Centre for Cerebro-Cardiovascular Health Engineering (COCHE), City University of Hong Kong (Grants No. 9667221, 9240074 and 9610444), and National Natural Science Foundation of China (Grants No. 62122002).

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  • NSFC-YPB-HK: 柔性智能感知技術

    YU, X. (Principal Investigator / Project Coordinator)

    1/01/2225/06/25

    Project: Research

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