Aging Characteristics of ICA for SMD on Flex

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

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Author(s)

Detail(s)

Original languageEnglish
Pages (from-to)181-184
Journal / PublicationMaterials Science Forum
Volume437-438
Online published15 Oct 2003
Publication statusPublished - 2003

Conference

TitleProceedings of the 2nd International Conference on Advanced Materials Processing
PlaceSingapore
CitySingapore
Period2 - 4 December 2002

Link(s)

DOI

DOI
Check@CityULib
Link to Scopus https://www.scopus.com/record/display.uri?eid=2-s2.0-0242291101&origin=recordpage
Permanent Link https://scholars.cityu.edu.hk/en/publications/publication(829f1ef1-b602-4f3f-9bad-74eb4fa5b51d).html

Abstract

In this paper, the aging characteristics of isotropically conductive adhesive (ICA) joints using surface mount device (SMD)-on-flex technology were, investigated, by noting the glass transition temperature (Tg) of ICA. Resistor-on-flex assemblies using ICA cured at 150 °C for 10 minutes were subjected to thermal aging at 40 and 125 °C for up to 1000 hours. Shear tests and microstructural examination were carried out. It was found that the aged ICA joints had their maximum shear stresses increased during the early stage, indicating the behaviour of further curing in the ICA. The joints aged at the elevated temperature seemed to degrade significantly after 200 hours. When the aging temperature was slightly above the Tg of ICA, significant decrease in shear strength was obtained. Moreover, microstructural examination with scanning electronic microscopy revealed that the significant decrease in shear strength was mainly due to formation of microcracks and delaminations which were caused by thermal mismatches. The fracture surface of the ICA was found to have different morphologies with different aging temperatures. © 2003 Trans Tech Publications Ltd, Switzerland

Research Area(s)

  • Degradation Mechanisms, Flex, ICA, Thermal Aging

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Publication fingerprints text

100
Surface Engineering
100
Characteristics Engineering
100
Aging Engineering
100
Conductive Adhesive Engineering
100
Temperature Material Science
100
Devices Material Science
100
Surface (Surface Sc... Material Science
100
surfaces INIS
100
aging INIS
100
devices INIS
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Citation Format(s)

[ RIS ] [ BibTeX ]
Aging Characteristics of ICA for SMD on Flex. / Wu, C. M. L.; Chau, M. L.
In: Materials Science Forum, Vol. 437-438, 2003, p. 181-184.

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review