Advances in materials for haptic skin electronics

Yuyu Gao (Co-first Author), Kuanming Yao (Co-first Author), Shengxin Jia (Co-first Author), Ya Huang, Guangyao Zhao, Binbin Zhang, Yiming Liu, Xinge Yu*

*Corresponding author for this work

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

21 Citations (Scopus)

Abstract

The advances in wearable and skin-integrated electronics bring new opportunities in virtual and augmented reality beyond traditional audiovisual modes, in which the haptic interface can be worn on the body to provide a more immersive virtual reality experience. Exploration of different materials and methods has greatly improved the precision and degrees of haptic sensations in skin electronics, enhancing the realism of tactile experiences for immersing in the virtual world. However, haptic technology based on skin electronics still faces numerous challenges, such as biocompatibility, functionality, and smart applications. This perspective provides insights on the applications of materials and designs in various haptic skin electronics and then outlines the challenges and prospects of existing haptic skin electronics. It begins with a brief review of the development of haptic devices, from early industrial applications to advanced wearable skin electronics. After that, we summarize the materials used in the haptic skin electronics from the perspectives of mechanical, electrical, thermal, and others. Finally, we discuss the challenges of existing haptic skin electronics and outlook on the potential implementation methods for overcoming these challenges to enhance the overall haptic experience in realizing haptic feeling. © 2024 Elsevier Inc.
Original languageEnglish
Pages (from-to)2826–2845
Number of pages20
JournalMatter
Volume7
Issue number9
Online published4 Sept 2024
DOIs
Publication statusPublished - 4 Sept 2024

Funding

This work was supported by the Foundation of National Natural Science Foundation of China (NSFC) (grant no. 62122002), research grants from the Council of the Hong Kong Special Administrative Region (grant nos. RFS2324-1S03, 11213721, 11215722, and 11211523), the City University of Hong Kong (grant nos. 9678267 and 9678274), and the Innovation and Shenzhen Science and Technology Innovation Commission (grant no. SGDX20220530111401011), as well as the Technology Fund of Innovation and Technology Commission (grant no. ITS/119/22).

RGC Funding Information

  • RGC-funded

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