Additively manufactured copper alloy with heterogeneous nanoprecipitates-dislocation architecture for superior strength-ductility-conductivity synergy
- Liqiang Wang
- , Shuo Qu
- , Huangliu Fu
- , Xin Zhou
- , Zongxin Hu
- , Yaojie Wen
- , Baicheng Zhang
- , Bin Gan*
- , Xu Song
- , Yang Lu
*Corresponding author for this work
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
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