Additive manufacturing of Ti–6Al–4V/Al–Cu–Mg multi-material structures with a Cu interlayer

Jinliang Zhang, Xiaobo Wang, Jianbao Gao, Lei Zhang, Bo Song*, Lijun Zhang, Yonggang Yao, Jian Lu, Yusheng Shi

*Corresponding author for this work

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

39 Citations (Scopus)

Abstract

Titanium–aluminum (Ti–Al) multi-material structures have tremendous potential for use in lightweight applications. Laser powder-bed fusion (LPBF) enables the preparation of multi materials owing to its high flexibility of material modulation. However, LPBF-produced Ti–Al multi-materials are highly susceptible to interface cracking. Here, we demonstrated a novel interface welding method of unwetting titanium and aluminum alloys in LPBF by introducing a copper interlayer, which is guided by thermodynamic calculations. The Cu interlayer effectively prevented the formation of Ti–Al IMCs and suppressed interface cracking. Multi-material Ti–6Al–4 V/Al–Cu–Mg (TiA/AlA) gyroid lattices were successfully prepared via LPBF and their deformation mechanisms were revealed both experimentally and computationally. Notably, multi-material TiA/AlA lattices where TiA and AlA were directly bonded suffered from severe interface cracking caused by detrimental Ti–Al compounds. By comparison, multi-material TiA/Cu/AlA lattices were crack-free at the interface and showed a local shear fracture mode where AlA portion deforms first, followed by the TiA portion without interfacial collapse, indicating the location-specific properties. © 2023 Elsevier Ltd. All rights reserved.
Original languageEnglish
Article number108477
JournalInternational Journal of Mechanical Sciences
Volume256
Online published25 May 2023
DOIs
Publication statusPublished - 15 Oct 2023

Funding

This work was sponsored by the National Natural Science Foundation of China (grant no. 51922044, 52205358), the State Key Laboratory of Powder Metallurgy (Central South University, Changsha, China), the State Key Laboratory of Advanced Welding and Joining (Harbin Institute of Technology, Harbin, China), the Key Area Research and Development Program of Guangdong Province (grant no. 2020B090923001), the Shenzhen–Hong Kong Science and Technology Innovation Cooperation Zone Shenzhen Park Project (grant no. HZQB-KCZYB-2020030), Hong Kong Scholars Program (grant no. XJ2022014), and the Academic Frontier Youth Team (grant no. 2018QYTD04) at the Huazhong University of Science and Technology. The authors thank the Analytical and Testing Center of HUST for the SEM observations and the State Key Laboratory of Materials Processing and Die & Mold Technology for the mechanical property tests.

Research Keywords

  • Al–Cu–Mg alloy
  • Gyroid lattice structures
  • Interface welding
  • Laser powder-bed fusion
  • Multi-materials
  • Ti–6Al–4V alloy

Fingerprint

Dive into the research topics of 'Additive manufacturing of Ti–6Al–4V/Al–Cu–Mg multi-material structures with a Cu interlayer'. Together they form a unique fingerprint.

Cite this