Additive manufacturing of Ni-based superalloys : Residual stress, mechanisms of crack formation and strategies for crack inhibition

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

60 Scopus Citations
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Author(s)

  • Chuan Guo
  • Sheng Li
  • Xiaogang Hu
  • Hongxing Lu
  • Xinggang Li
  • Zhen Xu
  • Qingqing Li
  • Qiang Zhu

Related Research Unit(s)

Detail(s)

Original languageEnglish
Pages (from-to)53-77
Journal / PublicationNano Materials Science
Volume5
Issue number1
Online published10 Sept 2022
Publication statusPublished - Mar 2023

Link(s)

Abstract

The additive manufacturing (AM) of Ni-based superalloys has attracted extensive interest from both academia and industry due to its unique capabilities to fabricate complex and high-performance components for use in high-end industrial systems. However, the intense temperature gradient induced by the rapid heating and cooling processes of AM can generate high levels of residual stress and metastable chemical and structural states, inevitably leading to severe metallurgical defects in Ni-based superalloys. Cracks are the greatest threat to these materials’ integrity as they can rapidly propagate and thereby cause sudden and non-predictable failure. Consequently, there is a need for a deeper understanding of residual stress and cracking mechanisms in additively manufactured Ni-based superalloys and ways to potentially prevent cracking, as this knowledge will enable the wider application of these unique materials. To this end, this paper comprehensively reviews the residual stress and the various mechanisms of crack formation in Ni-based superalloys during AM. In addition, several common methods for inhibiting crack formation are presented to assist the research community to develop methods for the fabrication of crack-free additively manufactured components.

Research Area(s)

  • Additive manufacturing, Mechanisms of crack formation, Methods of crack inhibition, Ni-based superalloys, Residual stress

Citation Format(s)

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