Achieving large uniform tensile elasticity in microfabricated diamond

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

12 Scopus Citations
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Author(s)

  • Jyh-Pin Chou
  • Bing Dai
  • Chang-Ti Chou
  • Yang Yang
  • Fanling Meng
  • Jiaqi Zhu
  • Jiecai Han
  • Andrew M. Minor
  • Ju Li

Detail(s)

Original languageEnglish
Pages (from-to)76-78
Journal / PublicationScience
Volume371
Issue number6524
Publication statusPublished - 1 Jan 2021

Abstract

Diamond is not only the hardest material in nature, but is also an extreme electronic material with an ultrawide bandgap, exceptional carrier mobilities, and thermal conductivity. Straining diamond can push such extreme figures of merit for device applications. We microfabricated single-crystalline diamond bridge structures with ~1 micrometer length by ~100 nanometer width and achieved samplewide uniform elastic strains under uniaxial tensile loading along the [100], [101], and [111] directions at room temperature. We also demonstrated deep elastic straining of diamond microbridge arrays. The ultralarge, highly controllable elastic strains can fundamentally change the bulk band structures of diamond, including a substantial calculated bandgap reduction as much as ~2 electron volts. Our demonstration highlights the immense application potential of deep elastic strain engineering for photonics, electronics, and quantum information technologies.

Citation Format(s)

Achieving large uniform tensile elasticity in microfabricated diamond. / Dang, Chaoqun; Chou, Jyh-Pin; Dai, Bing; Chou, Chang-Ti; Yang, Yang; Fan, Rong; Lin, Weitong; Meng, Fanling; Hu, Alice; Zhu, Jiaqi; Han, Jiecai; Minor, Andrew M.; Li, Ju; Lu, Yang.

In: Science, Vol. 371, No. 6524, 01.01.2021, p. 76-78.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review