A three-dimensional liquid diode for soft, integrated permeable electronics

Binbin Zhang (Co-first Author), Jiyu Li (Co-first Author), Jingkun Zhou (Co-first Author), Lung Chow (Co-first Author), Guangyao Zhao, Ya Huang, Zhiqiang Ma, Qiang Zhang, Yawen Yang, Chun Ki Yiu, Jian Li, Fengjun Chun, Xingcan Huang, Yuyu Gao, Pengcheng Wu, Shengxin Jia, Hu Li, Dengfeng Li, Yiming Liu, Kuanming YaoRui Shi, Zhenlin Chen, Bee Luan Khoo, Weiqing Yang, Feng Wang, Zijian Zheng, Zuankai Wang, Xinge Yu*

*Corresponding author for this work

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

168 Citations (Scopus)
131 Downloads (CityUHK Scholars)

Abstract

Wearable electronics with great breathability enable a comfortable wearing experience and facilitate continuous biosignal monitoring over extended periods1,2,3. However, current research on permeable electronics is predominantly at the stage of electrode and substrate development, which is far behind practical applications with comprehensive integration with diverse electronic components (for example, circuitry, electronics, encapsulation)4,5,6,7,8. Achieving permeability and multifunctionality in a singular, integrated wearable electronic system remains a formidable challenge. Here we present a general strategy for integrated moisture-permeable wearable electronics based on three-dimensional liquid diode (3D LD) configurations. By constructing spatially heterogeneous wettability, the 3D LD unidirectionally self-pumps the sweat from the skin to the outlet at a maximum flow rate of 11.6 ml cm−2 min−1, 4,000 times greater than the physiological sweat rate during exercise, presenting exceptional skin-friendliness, user comfort and stable signal-reading behaviour even under sweating conditions. A detachable design incorporating a replaceable vapour/sweat-discharging substrate enables the reuse of soft circuitry/electronics, increasing its sustainability and cost-effectiveness. We demonstrated this fundamental technology in both advanced skin-integrated electronics and textile-integrated electronics, highlighting its potential for scalable, user-friendly wearable devices.
Original languageEnglish
Pages (from-to)84-91
JournalNature
Volume628
Online published27 Mar 2024
DOIs
Publication statusPublished - 4 Apr 2024

Funding

This work was supported by the National Natural Science Foundation of China (grant no. 62122002), City University of Hong Kong (grant nos. 9667221, 9678274 and 9610444), as part of the InnoHK Project 2.2–AI-based 3D ultrasound imaging algorithm at Hong Kong Centre for Cerebro-cardiovascular Health Engineering (COCHE), the Research Grants Council of the Hong Kong Special Administrative Region (grants nos. 11213721, 11215722, 11211523 and RFS2324-1S03), Shenzhen Science and Technology Innovation Commission (grant no. SGDX20220530111401011) and the RGC Senior Research Fellow Scheme (SRFS2122-5S04).

Publisher's Copyright Statement

  • COPYRIGHT TERMS OF DEPOSITED POSTPRINT FILE: This version of the article has been accepted for publication, after peer review (when applicable) and is subject to Springer Nature’s AM terms of use, but is not the Version of Record and does not reflect post-acceptance improvements, or any corrections. The Version of Record is available online at: https://doi.org/10.1038/s41586-024-07161-1.

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