TY - GEN
T1 - A substrate integrated magic-T based on higher order mode cavity and slotline
AU - Wu, Peng
AU - Liao, Shaowei
AU - Xue, Quan
PY - 2016/2/18
Y1 - 2016/2/18
N2 - In this paper, a substrate integrated magic-T is presented and fabricated. It is based on the higher order mode cavity and buried slotline. The wideband transition of SIW TE20 mode is employed to realize the out-of-phase divider while the microstrip-to-slotline transition is used to realize the in-phase divider. The slot is etched on the top of the higher order mode cavity. The ground metal defects are buried inside the multilayer substrate, and thus, in practical applications, additional bolster is not required for the defected ground slot. It is convenient for the proposed magic-T to be integrated with other circuits.
AB - In this paper, a substrate integrated magic-T is presented and fabricated. It is based on the higher order mode cavity and buried slotline. The wideband transition of SIW TE20 mode is employed to realize the out-of-phase divider while the microstrip-to-slotline transition is used to realize the in-phase divider. The slot is etched on the top of the higher order mode cavity. The ground metal defects are buried inside the multilayer substrate, and thus, in practical applications, additional bolster is not required for the defected ground slot. It is convenient for the proposed magic-T to be integrated with other circuits.
KW - Higher order mode
KW - magic-T
KW - slotline
KW - transition
KW - substrate integrated waveguides
KW - SIW TE 20 mode
KW - buried slotline
KW - defected ground slot
KW - ground metal defects
KW - higher order mode cavity
KW - microstrip-to-slotline transition in-phase divider
KW - multilayer substrate
KW - out-of-phase divider
KW - Cities and towns
KW - Decision support systems
KW - Frequency measurement
KW - Microwave communication
KW - Phase measurementt
KW - Substrates
UR - https://www.scopus.com/pages/publications/84979021741
UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-84979021741&origin=recordpage
U2 - 10.1109/APMC.2015.7413074
DO - 10.1109/APMC.2015.7413074
M3 - RGC 32 - Refereed conference paper (with host publication)
SN - 9781479987658
VL - 2
BT - Asia-Pacific Microwave Conference Proceedings, APMC
PB - IEEE
T2 - Asia-Pacific Microwave Conference, APMC 2015
Y2 - 6 December 2015 through 9 December 2015
ER -