A study of high-temperature implantation of 72 keV copper ions into nickel

Wen-Fa Tsai, J. H. Liang, J. J. Kai, G. L. Kulcinski

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

3 Citations (Scopus)

Abstract

The depth profiles of 72 keV Cu ions (5 × 10 15 Cu -1 ions/cm 2) implanted into Ni at elevated temperatures (200, 400 and 500 °C) are investigated theoretically and experimentally. A tandem accelerator was used for implantation and the depth profiles were measured by SIMS. The theoretical depth profiles were calculated by a kinetic model which takes into account ion collection, lattice dilation, preferential sputtering, radiation-enhanced diffusion (RED) and radiation-induced segregation (RIS). The results demonstrated that our theoretical predictions are in good agreement qualitatively with measured ones, and the implantation temperatures have a significant effect on the final depth profiles of implanted ions. The effect is mainly due to RED and RIS, which are attributed to the point defects generated during ion implantation. © 2004 Elsevier B.V. All rights reserved.
Original languageEnglish
Pages (from-to)151-155
JournalNuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms
Volume228
Issue number1-4 SPEC. ISS.
DOIs
Publication statusPublished - Jan 2005
Externally publishedYes

Research Keywords

  • Accelerator
  • Ion implantation
  • Point defects
  • Radiation effects

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