A Simple and reproducible method towards fabricating defect-free and reliable solder joints

D. J. Xie; Y. C. Chan; J. K. L. Lai

doi:10.1109/IEMT.1995.526188

A Simple and reproducible method towards fabricating defect-free and reliable solder joints

Department of Electrical Engineering

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

Abstract

This paper describes a simple and reproducible method to obtain defect-free and reliable solder joints. That is to split the solder joints fabricated from an infrared (IR) reflow soldering process. The characteristics of split solder joints have been critically studied. It is found that the method of splitting is effective in eliminating pore formation (both gas and shrinkage pores) and inclusions in solder joints. The method is applicable to various solder pastes whether it be no-clean or water-soluble. Thermal and mechanical fatigue cycling tests show that fatigue life of the solder joints can be prolonged by more than 60% as compared to that without splitting. Fractographs illustrate that the fractured section in the fatigued joints occurs quite often at the interfaces of printed circuit board (PCB) and copper pads after splitting has been applied to the joints. This strongly testifies the solder portion has been strengthened by splitting. The proposed method is specially suitable for specimens with large pad area in each joint or where the pores or inclusions most likely appear. © 1595 IEEE

Original language	English
Title of host publication	Seventeenth IEEE/CPMT International Electronic Manufacturing Technology Symposium
Subtitle of host publication	“Manufacturing Technologies - Present and Future”
Publisher	IEEE
Pages	366-371
ISBN (Print)	0-7803-2996-1
DOIs	https://doi.org/10.1109/IEMT.1995.526188
Publication status	Published - Oct 1995
Event	17th IEEE/CPMT International Electronics Manufacturing Technology Symposium - Austin, TX, United States Duration: 2 Oct 1995 → 4 Oct 1995

Conference

Conference	17th IEEE/CPMT International Electronics Manufacturing Technology Symposium
Place	United States
City	Austin, TX
Period	2/10/95 → 4/10/95

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10.1109/IEMT.1995.526188

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@inproceedings{e80576b8e33340c48c9a460c9a0e9c6b,

title = "A Simple and reproducible method towards fabricating defect-free and reliable solder joints",

abstract = "This paper describes a simple and reproducible method to obtain defect-free and reliable solder joints. That is to split the solder joints fabricated from an infrared (IR) reflow soldering process. The characteristics of split solder joints have been critically studied. It is found that the method of splitting is effective in eliminating pore formation (both gas and shrinkage pores) and inclusions in solder joints. The method is applicable to various solder pastes whether it be no-clean or water-soluble. Thermal and mechanical fatigue cycling tests show that fatigue life of the solder joints can be prolonged by more than 60% as compared to that without splitting. Fractographs illustrate that the fractured section in the fatigued joints occurs quite often at the interfaces of printed circuit board (PCB) and copper pads after splitting has been applied to the joints. This strongly testifies the solder portion has been strengthened by splitting. The proposed method is specially suitable for specimens with large pad area in each joint or where the pores or inclusions most likely appear. {\textcopyright} 1595 IEEE",

author = "Xie, {D. J.} and Chan, {Y. C.} and Lai, {J. K. L.}",

year = "1995",

month = oct,

doi = "10.1109/IEMT.1995.526188",

language = "English",

isbn = "0-7803-2996-1",

pages = "366--371",

booktitle = "Seventeenth IEEE/CPMT International Electronic Manufacturing Technology Symposium",

publisher = "IEEE",

address = "United States",

note = "17th IEEE/CPMT International Electronics Manufacturing Technology Symposium ; Conference date: 02-10-1995 Through 04-10-1995",

}

Xie, DJ, Chan, YC & Lai, JKL 1995, A Simple and reproducible method towards fabricating defect-free and reliable solder joints. in Seventeenth IEEE/CPMT International Electronic Manufacturing Technology Symposium: “Manufacturing Technologies - Present and Future”. IEEE, pp. 366-371, 17th IEEE/CPMT International Electronics Manufacturing Technology Symposium, Austin, TX, United States, 2/10/95. https://doi.org/10.1109/IEMT.1995.526188

A Simple and reproducible method towards fabricating defect-free and reliable solder joints. / Xie, D. J.; Chan, Y. C.; Lai, J. K. L.
Seventeenth IEEE/CPMT International Electronic Manufacturing Technology Symposium: “Manufacturing Technologies - Present and Future”. IEEE, 1995. p. 366-371.

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

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T1 - A Simple and reproducible method towards fabricating defect-free and reliable solder joints

AU - Xie, D. J.

AU - Chan, Y. C.

AU - Lai, J. K. L.

PY - 1995/10

Y1 - 1995/10

N2 - This paper describes a simple and reproducible method to obtain defect-free and reliable solder joints. That is to split the solder joints fabricated from an infrared (IR) reflow soldering process. The characteristics of split solder joints have been critically studied. It is found that the method of splitting is effective in eliminating pore formation (both gas and shrinkage pores) and inclusions in solder joints. The method is applicable to various solder pastes whether it be no-clean or water-soluble. Thermal and mechanical fatigue cycling tests show that fatigue life of the solder joints can be prolonged by more than 60% as compared to that without splitting. Fractographs illustrate that the fractured section in the fatigued joints occurs quite often at the interfaces of printed circuit board (PCB) and copper pads after splitting has been applied to the joints. This strongly testifies the solder portion has been strengthened by splitting. The proposed method is specially suitable for specimens with large pad area in each joint or where the pores or inclusions most likely appear. © 1595 IEEE

AB - This paper describes a simple and reproducible method to obtain defect-free and reliable solder joints. That is to split the solder joints fabricated from an infrared (IR) reflow soldering process. The characteristics of split solder joints have been critically studied. It is found that the method of splitting is effective in eliminating pore formation (both gas and shrinkage pores) and inclusions in solder joints. The method is applicable to various solder pastes whether it be no-clean or water-soluble. Thermal and mechanical fatigue cycling tests show that fatigue life of the solder joints can be prolonged by more than 60% as compared to that without splitting. Fractographs illustrate that the fractured section in the fatigued joints occurs quite often at the interfaces of printed circuit board (PCB) and copper pads after splitting has been applied to the joints. This strongly testifies the solder portion has been strengthened by splitting. The proposed method is specially suitable for specimens with large pad area in each joint or where the pores or inclusions most likely appear. © 1595 IEEE

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M3 - RGC 32 - Refereed conference paper (with host publication)

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BT - Seventeenth IEEE/CPMT International Electronic Manufacturing Technology Symposium

PB - IEEE

T2 - 17th IEEE/CPMT International Electronics Manufacturing Technology Symposium

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ER -

A Simple and reproducible method towards fabricating defect-free and reliable solder joints

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