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A Sewing Approach to the Fabrication of Eco/bioresorbable Electronics

  • Yunyun Wu
  • , Eric Rytkin
  • , Miles Bimrose
  • , Shupeng Li
  • , Yeon Sik Choi
  • , Geumbee Lee
  • , Yue Wang
  • , Lichao Tang
  • , Micah Madrid
  • , Grace Wickerson
  • , Jan-Kai Chang
  • , Jianyu Gu
  • , Yamin Zhang
  • , Jiaqi Liu
  • , Sameh Tawfick
  • , Yonggang Huang
  • , William P. King
  • , Igor R. Efimov
  • , John A. Rogers*
  • *Corresponding author for this work

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

Abstract

Eco/bioresorbable electronics represent an emerging class of technology defined by an ability to dissolve or otherwise harmlessly disappear in environmental or biological surroundings after a period of stable operation. The resulting devices provide unique capabilities as temporary biomedical implants, environmental sensors, and related systems. Recent publications report schemes to overcome challenges in fabrication that follow from the low thermostability and/or high chemical reactivity of the eco/bioresorbable constituent materials. Here, this work reports the use of high-speed sewing machines, as the basis for a high-throughput manufacturing technique that addresses many requirements for these applications, without the need for high temperatures or reactive solvents. Results demonstrate that a range of eco/bioresorbable metal wires and polymer threads can be embroidered into complex, user-defined conductive patterns on eco/bioresorbable substrates. Functional electronic components, such as stretchable interconnects and antennas are possible, along with fully integrated systems. Examples of the latter include wirelessly powered light-emitting diodes, radiofrequency identification tags, and temporary cardiac pacemakers. These advances add to a growing range of options in high-throughput, automated fabrication of eco/bioresorbable electronics. © 2023 The Authors. Small published by Wiley-VCH GmbH.
Original languageEnglish
Article number2305017
Number of pages10
JournalSmall
Volume19
Issue number49
Online published1 Aug 2023
DOIs
Publication statusPublished - 6 Dec 2023
Externally publishedYes

Funding

This work made use of the Keck‐II facility and the NUFAB facility of Northwestern University's NUANCE Center, which has received support from the SHyNE Resource (NSF ECCS‐2025633), the IIN, and Northwestern's MRSEC program (NSF DMR‐1720139). Engineering efforts were supported by the Querrey Simpson Institute for Bioelectronics at Northwestern University.

Research Keywords

  • eco/bioresorbable electronic devices
  • eco/bioresorbable metal wires
  • eco/bioresorbable stretchable interconnects
  • embroidery
  • wireless stretchable pacemaker

Publisher's Copyright Statement

  • This full text is made available under CC-BY 4.0. https://creativecommons.org/licenses/by/4.0/

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