A Process Improvement in Silver-indium Transient Liquid Phase Bonding Method for the High-Power Electronics and Photonics Packaging

Donglin Zhang, Xiuchen Zhao, Yingxia Liu, Ying Liu, Yongjun Huo

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

4 Citations (Scopus)

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Engineering

Material Science

Chemical Engineering