A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly
Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Author(s)
Related Research Unit(s)
Detail(s)
| Original language | English |
|---|---|
| Article number | 867 |
| Number of pages | 13 |
| Journal / Publication | Micromachines |
| Volume | 13 |
| Issue number | 6 |
| Online published | 31 May 2022 |
| Publication status | Published - Jun 2022 |
Link(s)
| DOI | DOI |
|---|---|
| Attachment(s) | Documents
Publisher's Copyright Statement
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| Link to Scopus | https://www.scopus.com/record/display.uri?eid=2-s2.0-85131839944&origin=recordpage |
| Permanent Link | https://scholars.cityu.edu.hk/en/publications/publication(72b9a3fd-f208-4430-957d-efc03891c1da).html |
Abstract
We successfully achieved low-temperature assembly by reflowing the 13.5Sn-37.5Bi-45In4Pb quaternary eutectic solder paste and the SAC 305 solder ball together at 140 °C for 5 min. The wetting angle of the mixed solder joint is 17.55°. The overall atomic percent of Pb in the mixed solder joint is less than 1%, which can be further reduced or eliminated. Moreover, after aging at 80 °C for 25 days, we observed no obvious decrease in shear strength of the fully mixed solder joint, which is the most advantage of this assembly technique over Sn58Bi solder assembly. The Bi phase segregation at the interface is slowed down compared with Sn-Bi solder joint. This low-temperature assembly is promising to be applied in advanced packaging technology to replace the eutectic Sn-Bi solder.
Research Area(s)
- low-temperature soldering, 3D IC, Bi aggregation, Sn-Bi solder
Citation Format(s)
A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly. / Sun, Lingyao; Guo, Zhenhua; Zhao, Xiuchen et al.
In: Micromachines, Vol. 13, No. 6, 867, 06.2022.Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
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