A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly

Lingyao Sun; Zhenhua Guo; Xiuchen Zhao; Ying Liu; Kingning Tu; Yingxia Liu

doi:10.3390/mi13060867

A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly

Lingyao Sun, Zhenhua Guo, Xiuchen Zhao, Ying Liu, Kingning Tu, Yingxia Liu^*

^*Corresponding author for this work

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

17 Citations (Scopus)

127 Downloads (CityUHK Scholars)

Abstract

We successfully achieved low-temperature assembly by reflowing the 13.5Sn-37.5Bi-45In4Pb quaternary eutectic solder paste and the SAC 305 solder ball together at 140 °C for 5 min. The wetting angle of the mixed solder joint is 17.55°. The overall atomic percent of Pb in the mixed solder joint is less than 1%, which can be further reduced or eliminated. Moreover, after aging at 80 °C for 25 days, we observed no obvious decrease in shear strength of the fully mixed solder joint, which is the most advantage of this assembly technique over Sn58Bi solder assembly. The Bi phase segregation at the interface is slowed down compared with Sn-Bi solder joint. This low-temperature assembly is promising to be applied in advanced packaging technology to replace the eutectic Sn-Bi solder.

Original language	English
Article number	867
Number of pages	13
Journal	Micromachines
Volume	13
Issue number	6
Online published	31 May 2022
DOIs	https://doi.org/10.3390/mi13060867
Publication status	Published - Jun 2022

Research Keywords

low-temperature soldering
3D IC
Bi aggregation
Sn-Bi solder

Publisher's Copyright Statement

This full text is made available under CC-BY 4.0. https://creativecommons.org/licenses/by/4.0/

Access Output

10.3390/mi13060867

107435738.pdfFinal Published version, 13 MBLicence: CC BY

Other Access Options

Check CityUHK Library

Permanent Link

Right click to copy link

Cite this

@article{72b9a3fdf2084430957defc03891c1da,

title = "A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly",

abstract = "We successfully achieved low-temperature assembly by reflowing the 13.5Sn-37.5Bi-45In4Pb quaternary eutectic solder paste and the SAC 305 solder ball together at 140 °C for 5 min. The wetting angle of the mixed solder joint is 17.55°. The overall atomic percent of Pb in the mixed solder joint is less than 1%, which can be further reduced or eliminated. Moreover, after aging at 80 °C for 25 days, we observed no obvious decrease in shear strength of the fully mixed solder joint, which is the most advantage of this assembly technique over Sn58Bi solder assembly. The Bi phase segregation at the interface is slowed down compared with Sn-Bi solder joint. This low-temperature assembly is promising to be applied in advanced packaging technology to replace the eutectic Sn-Bi solder.",

keywords = "low-temperature soldering, 3D IC, Bi aggregation, Sn-Bi solder",

author = "Lingyao Sun and Zhenhua Guo and Xiuchen Zhao and Ying Liu and Kingning Tu and Yingxia Liu",

year = "2022",

month = jun,

doi = "10.3390/mi13060867",

language = "English",

volume = "13",

journal = "Micromachines",

issn = "2072-666X",

publisher = "Multidisciplinary Digital Publishing Institute (MDPI)",

number = "6",

}

TY - JOUR

T1 - A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly

AU - Sun, Lingyao

AU - Guo, Zhenhua

AU - Zhao, Xiuchen

AU - Liu, Ying

AU - Tu, Kingning

AU - Liu, Yingxia

PY - 2022/6

Y1 - 2022/6

N2 - We successfully achieved low-temperature assembly by reflowing the 13.5Sn-37.5Bi-45In4Pb quaternary eutectic solder paste and the SAC 305 solder ball together at 140 °C for 5 min. The wetting angle of the mixed solder joint is 17.55°. The overall atomic percent of Pb in the mixed solder joint is less than 1%, which can be further reduced or eliminated. Moreover, after aging at 80 °C for 25 days, we observed no obvious decrease in shear strength of the fully mixed solder joint, which is the most advantage of this assembly technique over Sn58Bi solder assembly. The Bi phase segregation at the interface is slowed down compared with Sn-Bi solder joint. This low-temperature assembly is promising to be applied in advanced packaging technology to replace the eutectic Sn-Bi solder.

AB - We successfully achieved low-temperature assembly by reflowing the 13.5Sn-37.5Bi-45In4Pb quaternary eutectic solder paste and the SAC 305 solder ball together at 140 °C for 5 min. The wetting angle of the mixed solder joint is 17.55°. The overall atomic percent of Pb in the mixed solder joint is less than 1%, which can be further reduced or eliminated. Moreover, after aging at 80 °C for 25 days, we observed no obvious decrease in shear strength of the fully mixed solder joint, which is the most advantage of this assembly technique over Sn58Bi solder assembly. The Bi phase segregation at the interface is slowed down compared with Sn-Bi solder joint. This low-temperature assembly is promising to be applied in advanced packaging technology to replace the eutectic Sn-Bi solder.

KW - low-temperature soldering

KW - 3D IC

KW - Bi aggregation

KW - Sn-Bi solder

UR - http://www.scopus.com/inward/record.url?scp=85131839944&partnerID=8YFLogxK

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-85131839944&origin=recordpage

U2 - 10.3390/mi13060867

DO - 10.3390/mi13060867

M3 - RGC 21 - Publication in refereed journal

C2 - 35744481

SN - 2072-666X

VL - 13

JO - Micromachines

JF - Micromachines

IS - 6

M1 - 867

ER -

A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly

Abstract

Research Keywords

Publisher's Copyright Statement

Access Output

Other Access Options

Permanent Link

Other Files and Links

Fingerprint

Cite this