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A NEW FABRICATION PROCESS FOR A FLEXIBLE SKIN WITH TEMPERATURE SENSOR ARRAY

  • Gwo-Bin Lee*
  • , Ji-How Wu
  • , Jiun-Jih Miau
  • *Corresponding author for this work

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

Abstract

In the present study, a new technique for fabrication of a flexible skin with 64 sensors inside a 7×7 mm2 area is reported. Each sensor has a dimension of 110 μm×110 μm. A simplified fabrication process using platinum resistors as sensing materials and polyimide layers as flexible substrates is developed. Systematic investigation of the performance of the sensors has been conducted, including sensors on rigid and flexible substrates for comparison. Sensors on rigid substrates have a sensitivity of 74.6 mV/°C with a cut-off frequency of 90 kHz using a constant-current circuit. Sensors on the flexible skin have been experimentally proven to have the same sensitivity as those on the rigid substrate. Moreover, the frequency response has been improved due to lower inertia for sensors on the flexible skin. The flexible skin with a temperature sensor array could be easily attached on a highly curved surface to detect temperature distribution inside a small area. The development of the temperature sensor array on the flexible skin could be crucial for temperature measurement in the fields of aerodynamics, space exploration, automaking etc. © 2002, Taylor & Francis Group, LLC.
Original languageEnglish
Pages (from-to)619-625
JournalChung-kuo Kung Ch'eng Hsueh K'an/Journal of the Chinese Institute of Engineers
Volume25
Issue number6
Online published3 Mar 2011
DOIs
Publication statusOnline published - 3 Mar 2011
Externally publishedYes

Research Keywords

  • Flexible skins
  • MEMS
  • Polyimide
  • Temperature sensors

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