A metastable phase of tin in 3D integrated circuit solder microbumps

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

13 Scopus Citations
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Author(s)

Detail(s)

Original languageEnglish
Pages (from-to)39-42
Journal / PublicationScripta Materialia
Volume102
Online published24 Feb 2015
Publication statusPublished - Jun 2015
Externally publishedYes

Abstract

A metastable phase of Sn has been found to co-exist with β-Sn in Pb-free SnAg microbumps in 3D integrated circuit technology. Synchrotron microbeam X-ray diffraction, high-resolution TEM imaging and selected-area electron diffraction were used to confirm the metastable phase, which has an orthorhombic lattice, with lattice parameter a = 0.635 nm, b = 0.639 nm, and c = 1.147 nm. Its composition is Sn containing a few percent of Ni. A higher rate of nucleation might have enabled its formation.

Research Area(s)

  • Electronic packaging, Lead-free solder, Metastable phases, Joining

Citation Format(s)

A metastable phase of tin in 3D integrated circuit solder microbumps. / Liu, Yingxia; Tamura, Nobumichi; Kim, Dong Wook; Gu, Sam; Tu, K. N.

In: Scripta Materialia, Vol. 102, 06.2015, p. 39-42.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review