A metastable phase of tin in 3D integrated circuit solder microbumps

Yingxia Liu; Nobumichi Tamura; Dong Wook Kim; Sam Gu; K. N. Tu

doi:10.1016/j.scriptamat.2015.02.009

A metastable phase of tin in 3D integrated circuit solder microbumps

Yingxia Liu
, Nobumichi Tamura
, Dong Wook Kim
, Sam Gu
, K. N. Tu^*

^*Corresponding author for this work

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

20 Citations (Scopus)

Abstract

A metastable phase of Sn has been found to co-exist with β-Sn in Pb-free SnAg microbumps in 3D integrated circuit technology. Synchrotron microbeam X-ray diffraction, high-resolution TEM imaging and selected-area electron diffraction were used to confirm the metastable phase, which has an orthorhombic lattice, with lattice parameter a = 0.635 nm, b = 0.639 nm, and c = 1.147 nm. Its composition is Sn containing a few percent of Ni. A higher rate of nucleation might have enabled its formation.

Original language	English
Pages (from-to)	39-42
Journal	Scripta Materialia
Volume	102
Online published	24 Feb 2015
DOIs	https://doi.org/10.1016/j.scriptamat.2015.02.009
Publication status	Published - Jun 2015
Externally published	Yes

Research Keywords

Electronic packaging
Lead-free solder
Metastable phases
Joining

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title = "A metastable phase of tin in 3D integrated circuit solder microbumps",

abstract = "A metastable phase of Sn has been found to co-exist with β-Sn in Pb-free SnAg microbumps in 3D integrated circuit technology. Synchrotron microbeam X-ray diffraction, high-resolution TEM imaging and selected-area electron diffraction were used to confirm the metastable phase, which has an orthorhombic lattice, with lattice parameter a = 0.635 nm, b = 0.639 nm, and c = 1.147 nm. Its composition is Sn containing a few percent of Ni. A higher rate of nucleation might have enabled its formation.",

keywords = "Electronic packaging, Lead-free solder, Metastable phases, Joining",

author = "Yingxia Liu and Nobumichi Tamura and Kim, \{Dong Wook\} and Sam Gu and Tu, \{K. N.\}",

year = "2015",

month = jun,

doi = "10.1016/j.scriptamat.2015.02.009",

language = "English",

volume = "102",

pages = "39--42",

journal = "Scripta Materialia",

issn = "1359-6462",

publisher = "Acta Materialia Inc",

}

TY - JOUR

T1 - A metastable phase of tin in 3D integrated circuit solder microbumps

AU - Liu, Yingxia

AU - Tamura, Nobumichi

AU - Kim, Dong Wook

AU - Gu, Sam

AU - Tu, K. N.

PY - 2015/6

Y1 - 2015/6

N2 - A metastable phase of Sn has been found to co-exist with β-Sn in Pb-free SnAg microbumps in 3D integrated circuit technology. Synchrotron microbeam X-ray diffraction, high-resolution TEM imaging and selected-area electron diffraction were used to confirm the metastable phase, which has an orthorhombic lattice, with lattice parameter a = 0.635 nm, b = 0.639 nm, and c = 1.147 nm. Its composition is Sn containing a few percent of Ni. A higher rate of nucleation might have enabled its formation.

AB - A metastable phase of Sn has been found to co-exist with β-Sn in Pb-free SnAg microbumps in 3D integrated circuit technology. Synchrotron microbeam X-ray diffraction, high-resolution TEM imaging and selected-area electron diffraction were used to confirm the metastable phase, which has an orthorhombic lattice, with lattice parameter a = 0.635 nm, b = 0.639 nm, and c = 1.147 nm. Its composition is Sn containing a few percent of Ni. A higher rate of nucleation might have enabled its formation.

KW - Electronic packaging

KW - Lead-free solder

KW - Metastable phases

KW - Joining

UR - https://www.scopus.com/pages/publications/84926195966

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-84926195966&origin=recordpage

U2 - 10.1016/j.scriptamat.2015.02.009

DO - 10.1016/j.scriptamat.2015.02.009

M3 - RGC 21 - Publication in refereed journal

SN - 1359-6462

VL - 102

SP - 39

EP - 42

JO - Scripta Materialia

JF - Scripta Materialia

ER -

A metastable phase of tin in 3D integrated circuit solder microbumps

Abstract

Research Keywords

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