A Medium for Binding Components in an Assembly of an Electronic Device, a Method of Preparing the Same, a Display Assembly of an Electronic Device, and a System for Simulating Mechanical Behaviours of the Electronic Device and the Medium

Research output: Patents, Agreements and Assignments (RGC: 51, 52, 53)51_Patents granted (CityU only, data source from KTO)Not applicable

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Original languageEnglish
Filing number16/387,759
Publication status
  • Accepted/In press/Filed - 18 Apr 2019

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