Abstract
A low-temperature bonding method for microfabrication of quartz microfluidic chips has been developed. The bonding process involved two steps: pre-bonding and post-annealing at low temperature. The bonding quality was evaluated by measuring the shear force at bonding interface and the electrical properties of the chips. Shear force of 5.66 MPa (566 N/cm2) was obtained in a bonded chip after a post-annealing at 200°C for 6 h. We owe the strong bonding strength to the formation of Si - O - Si bonds at the bonding interface during the post-annealing stage. The bonding procedures were not sensitive to surrounding and could be performed in a routine laboratory without clean room conditions. The performance of the fabricated microfluidic chips was tested by capillary zone electrophoresis (CZE) of serum lipoproteins with laser-induced fluorescence (LIF). The low-density (LDL) and high-density (HDL) lipoproteins in the serum was separated completely by using tricine buffer with methylglucamine. © Springer Science + Business Media, LLC 2006.
| Original language | English |
|---|---|
| Pages (from-to) | 255-261 |
| Journal | Biomedical Microdevices |
| Volume | 8 |
| Issue number | 3 |
| DOIs | |
| Publication status | Published - Sept 2006 |
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
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SDG 9 Industry, Innovation, and Infrastructure
Research Keywords
- Glass and/or quartz
- Low temperature bonding
- Microfluidic chip
- Serum lipoprotein
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