A low temperature bonding of quartz microfluidic chip for serum lipoproteins analysis

Guisheng Zhuang, Qinghui Jin, Jing Liu, Hui Cong, Kangdong Liu, Jianlong Zhao, Mengsu Yang, Huimin Wang

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    25 Citations (Scopus)

    Abstract

    A low-temperature bonding method for microfabrication of quartz microfluidic chips has been developed. The bonding process involved two steps: pre-bonding and post-annealing at low temperature. The bonding quality was evaluated by measuring the shear force at bonding interface and the electrical properties of the chips. Shear force of 5.66 MPa (566 N/cm2) was obtained in a bonded chip after a post-annealing at 200°C for 6 h. We owe the strong bonding strength to the formation of Si - O - Si bonds at the bonding interface during the post-annealing stage. The bonding procedures were not sensitive to surrounding and could be performed in a routine laboratory without clean room conditions. The performance of the fabricated microfluidic chips was tested by capillary zone electrophoresis (CZE) of serum lipoproteins with laser-induced fluorescence (LIF). The low-density (LDL) and high-density (HDL) lipoproteins in the serum was separated completely by using tricine buffer with methylglucamine. © Springer Science + Business Media, LLC 2006.
    Original languageEnglish
    Pages (from-to)255-261
    JournalBiomedical Microdevices
    Volume8
    Issue number3
    DOIs
    Publication statusPublished - Sept 2006

    Research Keywords

    • Glass and/or quartz
    • Low temperature bonding
    • Microfluidic chip
    • Serum lipoprotein

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