A Low-Cost Dielectrophoretic Chip with 3D Overlapping Electrodes for Cell Trapping Applications

Zhi LI; Yihang QIU; Winston SUN; Jianmin HU; Shaodong ZHAN; Guanglie ZHANG

doi:10.1109/CYBER.2018.8688108

A Low-Cost Dielectrophoretic Chip with 3D Overlapping Electrodes for Cell Trapping Applications

Zhi LI
, Yihang QIU
, Winston SUN
, Jianmin HU
, Shaodong ZHAN
, Guanglie ZHANG

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

Abstract

Cell trapping is the elementary operation for single cell analysis. In order to develop an automatic cell analysis system, we designed a low-cost dielectrophoretic (DEP)chip with 3D overlapping electrodes for cell trapping and manipulating. Preliminary experimental results of the fabricated DEP chip and some simulation results are presented in this paper. Upper and lower electrode patterns with minimum features of 5 μm were etched from ordinary 4 inch single-sided ITO substrates. SU8 wall structures with thickness of 80 μm were deposited to ensure constrained flow within the cavity. Following a simple assembly and straightforward setup, it was confirmed that the microbeads can be captured in the region where the upper and lower electrodes overlap as viewed from above. An alternative approach, such as through glass via (TGV)that involves a complicated fabrication process, is therefore not needed. The current approach largely reduce the cost of this cell-capturing chip based on the DEP effect.

Original language	English
Title of host publication	Proceedings of 2018 IEEE 8th Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems
Publisher	IEEE
Pages	1600-1604
ISBN (Electronic)	978-1-5386-7058-3
ISBN (Print)	978-1-5386-7057-6
DOIs	https://doi.org/10.1109/CYBER.2018.8688108
Publication status	Published - Jul 2018
Externally published	Yes
Event	8th Annual IEEE International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, IEEE-CYBER 2018 - Tianjin, China Duration: 19 Jul 2018 → 23 Jul 2018 https://ieeexplore.ieee.org/xpl/conhome/8672765/proceeding

Publication series

Name	Annual IEEE International Conference on Cyber Technology in Automation, Control and Intelligent Systems, CYBER

Conference

Conference	8th Annual IEEE International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, IEEE-CYBER 2018
Place	China
City	Tianjin
Period	19/07/18 → 23/07/18
Internet address	https://ieeexplore.ieee.org/xpl/conhome/8672765/proceeding

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10.1109/CYBER.2018.8688108

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LI, Z., QIU, Y., SUN, W., HU, J., ZHAN, S., & ZHANG, G. (2018). A Low-Cost Dielectrophoretic Chip with 3D Overlapping Electrodes for Cell Trapping Applications. In Proceedings of 2018 IEEE 8th Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems (pp. 1600-1604). Article 8688108 (Annual IEEE International Conference on Cyber Technology in Automation, Control and Intelligent Systems, CYBER). IEEE. https://doi.org/10.1109/CYBER.2018.8688108

LI, Zhi ; QIU, Yihang ; SUN, Winston et al. / A Low-Cost Dielectrophoretic Chip with 3D Overlapping Electrodes for Cell Trapping Applications. Proceedings of 2018 IEEE 8th Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems. IEEE, 2018. pp. 1600-1604 (Annual IEEE International Conference on Cyber Technology in Automation, Control and Intelligent Systems, CYBER).

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title = "A Low-Cost Dielectrophoretic Chip with 3D Overlapping Electrodes for Cell Trapping Applications",

abstract = "Cell trapping is the elementary operation for single cell analysis. In order to develop an automatic cell analysis system, we designed a low-cost dielectrophoretic (DEP)chip with 3D overlapping electrodes for cell trapping and manipulating. Preliminary experimental results of the fabricated DEP chip and some simulation results are presented in this paper. Upper and lower electrode patterns with minimum features of 5 μm were etched from ordinary 4 inch single-sided ITO substrates. SU8 wall structures with thickness of 80 μm were deposited to ensure constrained flow within the cavity. Following a simple assembly and straightforward setup, it was confirmed that the microbeads can be captured in the region where the upper and lower electrodes overlap as viewed from above. An alternative approach, such as through glass via (TGV)that involves a complicated fabrication process, is therefore not needed. The current approach largely reduce the cost of this cell-capturing chip based on the DEP effect.",

author = "Zhi LI and Yihang QIU and Winston SUN and Jianmin HU and Shaodong ZHAN and Guanglie ZHANG",

year = "2018",

month = jul,

doi = "10.1109/CYBER.2018.8688108",

language = "English",

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series = "Annual IEEE International Conference on Cyber Technology in Automation, Control and Intelligent Systems, CYBER",

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booktitle = "Proceedings of 2018 IEEE 8th Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems",

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note = "8th Annual IEEE International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, IEEE-CYBER 2018 ; Conference date: 19-07-2018 Through 23-07-2018",

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LI, Z, QIU, Y, SUN, W, HU, J, ZHAN, S & ZHANG, G 2018, A Low-Cost Dielectrophoretic Chip with 3D Overlapping Electrodes for Cell Trapping Applications. in Proceedings of 2018 IEEE 8th Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems., 8688108, Annual IEEE International Conference on Cyber Technology in Automation, Control and Intelligent Systems, CYBER, IEEE, pp. 1600-1604, 8th Annual IEEE International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, IEEE-CYBER 2018, Tianjin, China, 19/07/18. https://doi.org/10.1109/CYBER.2018.8688108

A Low-Cost Dielectrophoretic Chip with 3D Overlapping Electrodes for Cell Trapping Applications. / LI, Zhi; QIU, Yihang; SUN, Winston et al.
Proceedings of 2018 IEEE 8th Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems. IEEE, 2018. p. 1600-1604 8688108 (Annual IEEE International Conference on Cyber Technology in Automation, Control and Intelligent Systems, CYBER).

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

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T1 - A Low-Cost Dielectrophoretic Chip with 3D Overlapping Electrodes for Cell Trapping Applications

AU - LI, Zhi

AU - QIU, Yihang

AU - SUN, Winston

AU - HU, Jianmin

AU - ZHAN, Shaodong

AU - ZHANG, Guanglie

PY - 2018/7

Y1 - 2018/7

N2 - Cell trapping is the elementary operation for single cell analysis. In order to develop an automatic cell analysis system, we designed a low-cost dielectrophoretic (DEP)chip with 3D overlapping electrodes for cell trapping and manipulating. Preliminary experimental results of the fabricated DEP chip and some simulation results are presented in this paper. Upper and lower electrode patterns with minimum features of 5 μm were etched from ordinary 4 inch single-sided ITO substrates. SU8 wall structures with thickness of 80 μm were deposited to ensure constrained flow within the cavity. Following a simple assembly and straightforward setup, it was confirmed that the microbeads can be captured in the region where the upper and lower electrodes overlap as viewed from above. An alternative approach, such as through glass via (TGV)that involves a complicated fabrication process, is therefore not needed. The current approach largely reduce the cost of this cell-capturing chip based on the DEP effect.

AB - Cell trapping is the elementary operation for single cell analysis. In order to develop an automatic cell analysis system, we designed a low-cost dielectrophoretic (DEP)chip with 3D overlapping electrodes for cell trapping and manipulating. Preliminary experimental results of the fabricated DEP chip and some simulation results are presented in this paper. Upper and lower electrode patterns with minimum features of 5 μm were etched from ordinary 4 inch single-sided ITO substrates. SU8 wall structures with thickness of 80 μm were deposited to ensure constrained flow within the cavity. Following a simple assembly and straightforward setup, it was confirmed that the microbeads can be captured in the region where the upper and lower electrodes overlap as viewed from above. An alternative approach, such as through glass via (TGV)that involves a complicated fabrication process, is therefore not needed. The current approach largely reduce the cost of this cell-capturing chip based on the DEP effect.

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DO - 10.1109/CYBER.2018.8688108

M3 - RGC 32 - Refereed conference paper (with host publication)

SN - 978-1-5386-7057-6

T3 - Annual IEEE International Conference on Cyber Technology in Automation, Control and Intelligent Systems, CYBER

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PB - IEEE

T2 - 8th Annual IEEE International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, IEEE-CYBER 2018

Y2 - 19 July 2018 through 23 July 2018

ER -

LI Z, QIU Y, SUN W, HU J, ZHAN S, ZHANG G. A Low-Cost Dielectrophoretic Chip with 3D Overlapping Electrodes for Cell Trapping Applications. In Proceedings of 2018 IEEE 8th Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems. IEEE. 2018. p. 1600-1604. 8688108. (Annual IEEE International Conference on Cyber Technology in Automation, Control and Intelligent Systems, CYBER). doi: 10.1109/CYBER.2018.8688108

A Low-Cost Dielectrophoretic Chip with 3D Overlapping Electrodes for Cell Trapping Applications

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