A Lightweight AlTiVNb High-Entropy Alloy Film with High Strength-Ductility Synergy and Corrosion Resistance

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

2 Scopus Citations
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Author(s)

  • Xiaobin Feng
  • Chuangshi Feng
  • Yang Lu

Detail(s)

Original languageEnglish
Article number8568
Journal / PublicationMaterials
Volume15
Issue number23
Online published1 Dec 2022
Publication statusPublished - Dec 2022

Link(s)

Abstract

The simultaneous improvement of mechanical and corrosion resistance is of great significance for engineering applications. In this work, a novel lightweight amorphous structure AlTiVNb high-entropy alloy (HEA) film was fabricated by magnetron sputtering. The compression test of the AlTiVNb HEA film nanopillar exhibits a high compressive strength of up to 3.6 GPa and deformability approaching 58%. The high strength is affected by the disordered state, the nanostructure, and the lattice distortion effect, while the high ductility comes from the ductile shear band and the island structure. In addition, the AlTiVNb HEA film shows a current density of 4.90 x 10-8 A/cm2 and a potential of -0.234 V in the 3.5% NaCl solution, comparable to that of the 316L stainless steel. The chemical disorder state, cocktail effect, and homogeneous amorphous structure contribute to excellent corrosion resistance. This finding offers new insights into high-performance HEA films with robust mechanical and anticorrosion performances for microelectronic devices and mechanical metamaterials.

Research Area(s)

  • AlTiVNb, lightweight high-entropy alloy film, amorphous structure, strength-ductility synergy, corrosion resistance, MECHANICAL-PROPERTIES, MICROSTRUCTURE, VOIDS

Citation Format(s)

A Lightweight AlTiVNb High-Entropy Alloy Film with High Strength-Ductility Synergy and Corrosion Resistance. / Feng, Xiaobin; Feng, Chuangshi; Lu, Yang.

In: Materials, Vol. 15, No. 23, 8568, 12.2022.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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